ꢀ ꢁꢂ ꢃꢄ ꢅꢆ ꢃꢅ
ꢇꢈ ꢉꢈ ꢊꢋꢌ ꢀꢈ ꢉ ꢍꢋꢌ ꢎꢏ ꢐ ꢆꢑ ꢀ ꢀꢐ ꢏ
SOURCED FROM: SGUS014H − FEBRUARY 1991 − REVISED JUNE 2004
SMJ320C30 part order information
POWER
SUPPLY
OPERATING
FREQUENCY
PROCESSING
LEVEL
DEVICE
TECHNOLOGY
PACKAGE TYPE
Ceramic 181-pin PGA
SMJ320C30GBM40
SM320C30GBM40
0.7-µm CMOS
0.7-µm CMOS
5 V 5%
5 V 5%
40 MHz
QML
40 MHz
Ceramic 181-pin PGA
Standard
Ceramic 196-pin quad flatpack with
nonconductive tie bar
SMJ320C30HFGM40
0.7-µm CMOS
5 V 5%
40 MHz
QML
Ceramic 196-pin quad flatpack with
nonconductive tie bar
SM320C30HFGM40
5962−9052604MXA
5962−9052604MUA
0.7-µm CMOS
0.7-µm CMOS
0.7-µm CMOS
5 V 5%
5 V 5%
5 V 5%
40 MHz
40 MHz
40 MHz
Standard
DESC SMD
DESC SMD
Ceramic 181-pin PGA
Ceramic 196-pin quad flatpack with
nonconductive tie bar
SMJ320C30GBM50
SM320C30GBM50
0.7-µm CMOS
0.7-µm CMOS
5 V 5%
5 V 5%
50 MHz
50 MHz
Ceramic 181-pin PGA
Ceramic 181-pin PGA
QML
Standard
Ceramic 196-pin quad flatpack with
nonconductive tie bar
SMJ320C30HFGM50
0.7-µm CMOS
5 V 5%
50 MHz
QML
Ceramic 196-pin quad flatpack with
nonconductive tie bar
SM320C30HFGM50
5962−9052605MXA
5962−9052605MUA
0.7-µm CMOS
0.7-µm CMOS
0.7-µm CMOS
5 V 5%
5 V 5%
5 V 5%
50 MHz
50 MHz
50 MHz
Standard
DESC SMD
DESC SMD
Ceramic 181-pin PGA
Ceramic 196-pin quad flatpack with
nonconductive tie bar
SMJ
320
C
30
GB
M
40
SPEED RANGE
PREFIX
40
50
=
=
40 MHz
50 MHz
SMJ = MIL-STD-38535 (QML)
SM Standard Processing
=
TEMPERATURE RANGE
DEVICE FAMILY
320 SMJ320 Family
M = − 55°C to125°C
=
L =
0°C to 70°C
PACKAGE TYPE
TECHNOLOGY
C = CMOS
GB
=
=
=
181-Pin Grid Array (PGA) Ceramic
Package
HFG
KGD
196-Pin Ceramic Quad Flatpack with a
nonconductive tie bar
Known Good Die
DEVICE
30 = 320C30
Figure 31. SMJ320C30 Device Nomenclature
41
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
TI [ TEXAS INSTRUMENTS ]
