ꢀ ꢁ ꢂꢃ ꢄ ꢅ ꢆꢃ ꢅ
ꢇ ꢈꢉ ꢈꢊꢋ ꢌ ꢀꢈ ꢉꢍ ꢋ ꢌ ꢎ ꢏꢐ ꢆꢑ ꢀꢀ ꢐꢏ
SOURCED FROM: SGUS014H − FEBRUARY 1991 − REVISED JUNE 2004
MECHANICAL DATA
HFG (S-CQFP-F196)
CERAMIC QUAD FLATPACK WITH TIE BAR
1.365 (34,67)
1.325 (33,66)
Thermal Resistance Characteristics
PARAMETER
°C/W
28.9
1.3
1.200 (30,48) TYP
0.600 (15,20) TYP
R
θJA
“A”
0.225 (5,72)
0.175 (4,45)
R
θJC
Tie Bar Width
49
1
50
196
2.505 (63,63)
2.485 (63,12)
1.710 (43,43)
1.690 (42,93)
98
148
99
147
“C”
1.150 (29,21)
8 Places
“B”
0.061 (1,55)
DIA 4 Places
0.059 (1,50)
0.105 (2,67) MAX
0.018 (0,46) MAX
0.010 (0,25)
0.006 (0,15)
196 ꢀ
Braze
0.014 (0,36)
0.002 (0,05)
0.040 (1,02)
0.030 (0,76)
0.008 (0,20)
0.004 (0,10)
0.020 (0,51) MAX
DETAIL “B”
0.025 (0,64)
DETAIL “A”
0.130 (3,30) MAX
DETAIL “C”
4040231-6/F 04/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Ceramic quad flatpack with flat leads brazed to nonconductive tie-bar carrier
D. This package can be hermetically sealed with a metal lid.
E. The terminals will be gold plated.
F. Falls within JEDEC MO-113 AB
The above data applies to the SMJ320C30 196-pin QFP.
42
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443