ꢀ ꢁꢂ ꢃꢄ ꢅꢆ ꢃꢅ
ꢇꢈ ꢉꢈ ꢊꢋꢌ ꢀꢈ ꢉ ꢍꢋꢌ ꢎꢏ ꢐ ꢆꢑ ꢀ ꢀꢐ ꢏ
SOURCED FROM: SGUS014H − FEBRUARY 1991 − REVISED JUNE 2004
MECHANICAL DATA (CONTINUED)
GA-GB (S-CPGA-P15 X 15)
CERAMIC PIN GRID ARRAY PACKAGE
A or A1 SQ
1.400 (35,56) TYP
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
DIM
A
MIN
MAX
Notes
Large
Outline
1.540 (39,12)
1.480 (37,59)
0.110 (2,79)
0.095 (2,41)
0.040 (1,02)
0.025 (0,63)
1.590 (40,38)
1.535 (38,99)
0.205 (5,21)
0.205 (5,21)
0.060 (1,52)
0.060 (1,52)
B or B1
Small
Outline
A1
B
Cavity
Up
Cavity
Down
B1
C
C or C1
Cavity
Up
0.140 (3,56)
0.120 (3,05)
0.050 (1,27) DIA
4 Places
Cavity
Down
C1
0.100 (2,54)
0.022 (0,55)
DIA TYP
MAXIMUM PINS WITHIN MATRIX − 225
0.016 (0,41)
4040114-8/C 04/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Index mark may appear on top or bottom depending on package vendor.
D. Pins are located within 0.010 (0,25) diameter of true position relative to each other at maximum material condition and within
0.030 (0,76) diameter relative to the edges of the ceramic.
E. This package can be hermetically sealed with metal lids or with ceramic lids using glass frit.
F. The pins can be gold plated or solder dipped.
G. Falls within MIL-STD-1835 CMGA7-PN and CMGA19-PN and JEDEC MO-067AG and MO-066AG, respectively
Thermal Resistance Characteristics
PARAMETER
°C/W
26.6
1.1
R
θJA
R
θJC
The above data applies to the SMJ320C30 181-pin PGA.
43
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
TI [ TEXAS INSTRUMENTS ]
