LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358Y, LM2904, LM2904Q
DUAL OPERATIONAL AMPLIFIERS
SLOS068C – JUNE 1976 – REVISED JULY 1998
LM358Y chip information
These chips, when properly assembled, display characteristics similar to the LM358. Thermal compression or
ultrasonic bonding can be used on the doped-aluminum bonding pads. Chips can be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(7)
(6)
(5)
V
CC+
(8)
(3)
(2)
1IN+
1IN–
(1)
+
–
1OUT
(5)
(6)
2IN+
2IN–
(7)
+
–
2OUT
(4)
57
(4)
V
(8)
CC–
Chip Thickness: 15 Typical
Bonding Pads: 4 × 4 Minimum
T
= 150°C
J(max)
Tolerances Are ±10%.
All Dimensions Are in Mils.
No Backside Metallization
Pin (4) is Internally Connected to Backside of Chip.
(3)
(1)
(2)
47
3
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