DM385, DM388
SPRS821D –MARCH 2013–REVISED DECEMBER 2013
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High-Performance System-on-Chip (SoC) ......... 1
1.1 Features ............................................. 1
1.2 Applications .......................................... 3
1.3 Description ........................................... 4
1.4 Functional Block Diagram ........................... 5
Module ............................................ 129
7.2 Power .............................................. 129
7.3 Reset .............................................. 137
7.4 Clocking ........................................... 145
7.5 Interrupts .......................................... 159
Peripheral Information and Timings ............. 162
8.1 Parameter Information ............................ 162
Revision History .............................................. 7
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8
Device Overview ........................................ 8
2.1 Device Comparison .................................. 8
2.2 Device Characteristics ............................... 8
2.3 Device Compatibility ................................ 10
8.2
Recommended Clock and Control Signal Transition
Behavior ........................................... 163
8.3 Audio Tracking Logic (ATL) ....................... 164
8.4 EDMA ............................................. 165
8.5 Emulation Features and Capability ............... 168
8.6 Ethernet MAC Switch (EMAC SW) ................ 172
2.4
ARM® Cortex™-A8 Microprocessor Unit
(Processor) Subsystem Overview .................. 10
2.5 Media Controller Overview ......................... 12
2.6 HDVICP2 Overview ................................ 12
2.7 Face Detect (FD) Overview ........................ 12
2.8 Spinlock Module Overview ......................... 13
2.9 Mailbox Module Overview .......................... 14
2.10 Memory Map Summary ............................. 15
Device Pins ............................................. 22
3.1 Pin Maps ........................................... 22
3.2 Pin Assignments .................................... 33
3.3 Terminal Functions ................................. 63
Device Configurations .............................. 108
4.1 Control Module Registers ......................... 108
4.2 Boot Modes ....................................... 108
4.3 Pin Multiplexing Control ........................... 115
4.4 Handling Unused Pins ............................ 117
4.5 DeBugging Considerations ........................ 117
System Interconnect ................................ 119
Device Operating Conditions ...................... 123
6.1 Absolute Maximum Ratings ....................... 123
6.2 Recommended Operating Conditions ............. 124
6.3 Reliability Data .................................... 126
8.7
General-Purpose Input/Output (GPIO) ............ 181
General-Purpose Memory Controller (GPMC) and
8.8
Error Location Module (ELM) ..................... 183
8.9
High-Definition Multimedia Interface (HDMI) ...... 198
8.10 High-Definition Video Processing Subsystem
(HDVPSS) ......................................... 201
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8.11 Inter-Integrated Circuit (I2C) ...................... 209
8.12 Imaging Subsystem (ISS) ......................... 212
8.13 DDR2/DDR3/DDR3L Memory Controller .......... 217
8.14 Multichannel Audio Serial Port (McASP) .......... 251
8.15 MultiMedia Card/Secure Digital/Secure Digital Input
Output (MMC/SD/SDIO) ........................... 256
8.16 Peripheral Component Interconnect Express (PCIe)
..................................................... 258
8.17 Serial Peripheral Interface (SPI) .................. 261
8.18 Timers ............................................. 267
8.19 Universal Asynchronous Receiver/Transmitter
(UART) ............................................ 269
8.20 Universal Serial Bus (USB2.0) .................... 271
Device and Documentation Support ............. 273
9.1 Device Support .................................... 273
9.2 Documentation Support ........................... 275
9.3 Community Resources ............................ 275
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6.4
Electrical Characteristics Over Recommended
Ranges of Supply Voltage and Operating
Temperature (Unless Otherwise Noted) .......... 127
10 Mechanical ............................................ 276
10.1 Thermal Data for the AAR ........................ 276
10.2 Packaging Information ............................ 276
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Power, Reset, Clocking, and Interrupts ......... 129
7.1
Power, Reset and Clock Management (PRCM)
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Contents
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