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CC2640R2LRGZR 参数 Datasheet PDF下载

CC2640R2LRGZR图片预览
型号: CC2640R2LRGZR
PDF下载: 下载PDF文件 查看货源
内容描述: [SimpleLink™ 低功耗 Bluetooth® 5.1 无线 MCU | RGZ | 48 | -40 to 85]
分类和应用: 无线
文件页数/大小: 54 页 / 3467 K
品牌: TI [ TEXAS INSTRUMENTS ]
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CC2640R2L  
ZHCSRK4A APRIL 2020 REVISED SEPTEMBER 2020  
www.ti.com.cn  
8 Specifications  
8.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)(1) (2)  
MIN  
MAX UNIT  
VDDR supplied by internal DC/DC regulator or  
internal GLDO. VDDS_DCDC connected to VDDS  
on PCB  
Supply voltage (VDDS, VDDS2,  
and VDDS3)  
4.1  
V
V
0.3  
Supply voltage (VDDS(3) and  
VDDR)  
External regulator mode (VDDS and VDDR pins  
connected on PCB)  
2.25  
0.3  
Voltage on any digital pin(4) (5)  
VDDSx + 0.3, max 4.1  
V
V
0.3  
0.3  
0.3  
0.3  
0.3  
Voltage on crystal oscillator pins, X32K_Q1, X32K_Q2, X24M_N and X24M_P  
Voltage scaling enabled  
VDDR + 0.3, max 2.25  
VDDS  
1.49  
Voltage on ADC input (Vin)  
Voltage scaling disabled, internal reference  
Voltage scaling disabled, VDDS as reference  
V
VDDS / 2.9  
5
Input RF level  
Tstg  
dBm  
°C  
Storage temperature  
150  
40  
(1) All voltage values are with respect to ground, unless otherwise noted.  
(2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating  
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(3) In external regulator mode, VDDS2 and VDDS3 must be at the same potential as VDDS.  
(4) Including analog-capable DIO.  
(5) Each pin is referenced to a specific VDDSx (VDDS, VDDS2 or VDDS3). For a pin-to-VDDS mapping table, see 9-2.  
8.2 ESD Ratings  
VALUE  
UNIT  
Human body model (HBM), per ANSI/ESDA/  
JEDEC JS001(1)  
All pins  
±2500  
Electrostatic discharge  
VESD  
V
(RHB and RGZ packages)  
RF pins  
±500  
±500  
Charged device model (CDM), per JESD22-  
C101(2)  
Non-RF pins  
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
8.3 Recommended Operating Conditions  
over operating free-air temperature range (unless otherwise noted)  
MIN  
MAX UNIT  
Ambient temperature  
85  
°C  
40  
Operating supply  
voltage (VDDS and  
VDDR), external  
regulator mode  
For operation in 1.8-V systems  
(VDDS and VDDR pins connected on PCB, internal DC/DC cannot be used)  
1.7  
1.95  
V
Operating supply  
voltage VDDS  
1.8  
1.8  
3.8  
3.8  
V
V
Operating supply  
voltages VDDS2 and  
VDDS3  
For operation in battery-powered and 3.3-V systems  
(internal DC/DC can be used to minimize power consumption)  
VDDS < 2.7 V  
Operating supply  
voltages VDDS2 and  
VDDS3  
1.9  
3.8  
V
VDDS 2.7 V  
Copyright © 2023 Texas Instruments Incorporated  
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