ADS1115-Q1
SBAS563 –DECEMBER 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
ORDERABLE P/N
TA
PACKAGE
TOP SIDE SYMBOL
ADS1115QDGSRQ1
-40°C to 125°C
VSSOP - DGS/ Reel of 2500
BCOQ
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or see the TI web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
VALUE
–0.3 to +5.5
100, momentary
10, continuous
–0.3 to VDD + 0.3
–0.5 to +5.5
+150
UNIT
V
VDD to GND
Analog input current
mA
mA
V
Analog input current
Analog input voltage to GND
SDA, SCL, ADDR, ALERT/RDY voltage to GND
Maximum junction temperature
Storage temperature range
V
°C
°C
–60 to +150
(1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
THERMAL INFORMATION
ADS1115-Q1
THERMAL METRIC(1)
DGS
10 PINS
187.44
51.28
108.97
2.78
UNITS
θJA
Junction-to-ambient thermal resistance
θJCtop
θJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ψJB
107.11
n/a
θJCbot
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
Submit Documentation Feedback
Copyright © 2011, Texas Instruments Incorporated
Product Folder Link(s) :ADS1115-Q1
TI [ TEXAS INSTRUMENTS ]
