APPENDIX C
FORMS A PART OF SMD 5962-89598
Pad number
Top left corner reference
Pad
Position relative to center of die
(dimensions are in millimeters)
Rotation angle
In degrees
Manufacturer
Pad reference
Signal
name
X
Y
1
A
A
A
A
A
A
A
A
A
B
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
-7,706
2,297
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
(A3)
(A2)
(Al)
2
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,706
-7,488
-7,227
-6,947
-5,787
-4,787
-3,787
-0,187
3,813
2,117
1,937
1,757
1,522
1,242
0,992
0,742
0,242
0,042
-0,158
-0,408
-0,688
-0,913
-1,138
-1,418
-1,698
-1,938
-2,118
-2,298
-2,504
-2,504
-2,504
-2,504
-2,504
-2,504
-2,504
-2,504
-2,504
3
4
(A0)
(1/O0)
I/O1
Gnd
I/O2
Gnd
Gnd
Gnd
I/O3
I/O4
Gnd
I/O5
(I/O6)
(I/O7)
(CS1/)
(A1O)
(OE/)
I/O6
Gnd
I/O7
CS1/
Al0
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
OE/
Gnd
All
4,813
A9
Figure A-1, MMO-65608EV Bond Pad Locations and Functions
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89598
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
SHEET
L
50
DSCC FORM 2234
APR 97
TEMIC [ TEMIC SEMICONDUCTORS ]
