APPENDIX C
FORMS A PART OF SMD 5962-89598
Pad number
Top left corner reference
Pad
Position relative to center of die
(dimensions are in millimeters)
Rotation angle
In degrees
Manufacturer
Pad reference
Signal
name
X
Y
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
A
A
A
A
A
A
A
A
A
A
A
A
B
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
5,813
-2,504
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
49
50
51
52
53
54
55
56
57
58
59
60
61
62
1
A8
A13
W/
6,613
7,213
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,722
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,729
7,638
6,813
6,613
4,413
0,013
-3,787
-4,787
-6,787
-6,387
-7,481
-2,504
-2,504
-2,333
-2,158
-1,983
-1,808
-1,633
-1,407
-1,183
-0,983
-0,188
0,042
0,272
0,842
1,067
1,267
1,436
1,617
1,792
1,967
2,142
2,323
2,504
2,504
2,504
2,504
2,504
2,804
2,504
2,504
2,504
2,504
(A11)
(A9)
(A8)
(A13)
(W)
CS2
Gnd
A15
Vcc
Vcc
Vcc
A16
Gnd
A14
(A12)
(A7)
(A6)
(A5)
(A4)
A12
A7
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
A6
A5
A4
Gnd
A3
A2
A1
A0
I/O0
Figure A-1, MMO-65608EV Bond Pad Locations and Functions – Continued
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-89598
A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
L
SHEET
51
DSCC FORM 2234
APR 97
TEMIC [ TEMIC SEMICONDUCTORS ]
