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ICM-20602 参数 Datasheet PDF下载

ICM-20602图片预览
型号: ICM-20602
PDF下载: 下载PDF文件 查看货源
内容描述: [High Performance 6-Axis MEMS MotionTracking Device]
分类和应用:
文件页数/大小: 57 页 / 1348 K
品牌: TDK [ TDK ELECTRONICS ]
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ICM-20602  
1 INTRODUCTION  
1.1 PURPOSE AND SCOPE  
This document is a product specification, providing a description, specifications, and design related information on the ICM-ꢈꢆꢉꢆꢈ™  
MotionTracking device. The device is housed in a small 3 mm x 3 mm x 0.75 mm 16-pin LGA package.  
1.2 PRODUCT OVERVIEW  
The ICM-20602 is a 6-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, in a small  
3 mm x 3 mm x 0.75 mm (16-pin LGA) package. It also features a 1 KB FIFO that can lower the traffic on the serial bus interface, and  
reduce power consumption by allowing the system processor to burst read sensor data and then go into a low-power mode. ICM-  
20602, with its 6-axis integration, enables manufacturers to eliminate the costly and complex selection, qualification, and system  
level integration of discrete devices, guaranteeing optimal motion performance for consumers.  
The gyroscope has a programmable full-scale range of ±250 dps, ±500 dps, ±1000 dps, and ±2000 dps. The accelerometer has a user-  
programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g. Factory-calibrated initial sensitivity of both sensors  
reduces production-line calibration requirements.  
Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, an embedded temperature sensor, and  
programmable interrupts. The device features I2C and SPI serial interfaces,, a VDD operating range of 1.71V to 3.45V, and a separate  
digital IO supply, VDDIO from 1.71V to 3.45V.  
Communication with all registers of the device is performed using either I2C at 400 kHz or SPI at 10 MHz.  
By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS wafers with companion  
CMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a footprint and thickness of 3 mm x  
3 mm x 0.75 mm (16-pin LGA), to provide a very small yet high performance low cost package. The device provides high robustness  
by supporting 20,000g shock reliability.  
1.3 APPLICATIONS  
Smartphones and Tablets  
Wearable Sensors  
Document Number: DS-000176  
Revision: 1.0  
Page 7 of 57  
Revision Date: 10/03/2016  
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