VND5012AK-E
Figure 4. Configuration Diagram (Top View) & Suggested Connections For Unused and n.c. Pins
V
CC
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
16
15
14
13
OUTPUT2
OUTPUT2
OUTPUT2
OUTPUT2
OUTPUT2
OUTPUT2
OUTPUT1
OUTPUT1
OUTPUT1
OUTPUT1
OUTPUT1
OUTPUT1
GND
N.C.
INPUT2
N.C.
INPUT1
N.C.
CURRENT SENSE1
N.C.
CURRENT SENSE2
9
10
11
12
CS_DIS
V
CC
TAB = V
CC
Connection / Pin Current Sense
N.C.
Output
Input
CS_DIS
Floating
X
X
X
X
Through 1KΩ
Through 10KΩ
Through 10KΩ
To Ground
resistor
X
resistor
resistor
Table 4. Absolute Maximum Ratings
Symbol
Parameter
Value
41
Unit
V
V
CC
DC supply voltage
-V
Reverse DC supply voltage
DC reverse ground pin current
DC output current
-0.3
V
CC
- I
GND
-200
mA
A
I
Internally limited
-30
OUT
- I
OUT
Reverse DC output current
DC input current
A
I
IN
-1 to 10
-1 to 10
mA
mA
V
I
DC current sense disable input current
CSD
V
-41
CC
V
Current sense maximum voltage
CSENSE
+V
V
CC
V
Electrostatic discharge (R=1.5kΩ; C=100pF)
Junction operating temperature
Storage temperature
2000
V
ESD
T
-40 to 150
-55 to 150
°C
°C
j
T
stg
Table 5. Thermal Data
Symbol
Parameter
Max Value
1.7
Unit
°C/W
°C/W
R
Thermal resistance junction-case
Thermal resistance junction-ambient
thj-case
R
52 (see note 1)
thj-amb
2
Note: 1. When mounted on a standard single-sided FR4 board with 1cm of Cu (at least 35µm thick) connected to TAB.
3/13
STMICROELECTRONICS [ ST ]
