STM32F405xx, STM32F407xx
Electrical characteristics
Table 27. Peripheral current consumption (continued)
Peripheral(1)
168 MHz
144 MHz
Unit
SDIO
0.64
1.47
1.58
0.68
0.45
0.47
2.20
2.04
2.10
0.14
0.34
0.34
0.54
1.14
1.22
0.54
0.36
0.38
2.10
1.93
2.00
0.12
0.27
0.28
TIM1
TIM8
TIM9
TIM10
TIM11
ADC1(5)
ADC2(5)
ADC3(5)
SPI1
APB2
mA
USART1
USART6
1. HSE oscillator with 4 MHz crystal and PLL are ON.
2. I2SMOD bit set in SPI_I2SCFGR register, and then the I2SE bit set to enable I2S peripheral.
3. EN1 bit is set in DAC_CR register.
4. EN2 bit is set in DAC_CR register.
5. ADON bit set in ADC_CR2 register.
5.3.7
Wakeup time from low-power mode
The wakeup times given in Table 28 is measured on a wakeup phase with a 16 MHz HSI
RC oscillator. The clock source used to wake up the device depends from the current
operating mode:
•
•
Stop or Standby mode: the clock source is the RC oscillator
Sleep mode: the clock source is the clock that was set before entering Sleep mode.
All timings are derived from tests performed under ambient temperature and V supply
DD
voltage conditions summarized in Table 14.
Table 28. Low-power mode wakeup timings
Symbol
Parameter
Wakeup from Sleep mode
Min(1)
Typ(1) Max(1) Unit
(2)
tWUSLEEP
-
-
-
1
-
-
µs
µs
µs
Wakeup from Stop mode (regulator in Run mode)
13
17
Wakeup from Stop mode (regulator in low power mode)
40
(2)
tWUSTOP
Wakeup from Stop mode (regulator in low power mode
and Flash memory in Deep power down mode)
-
110
375
-
(2)(3)
tWUSTDBY
Wakeup from Standby mode
260
480
1. Based on characterization, not tested in production.
2. The wakeup times are measured from the wakeup event to the point in which the application code reads the first instruction.
3. tWUSTDBY minimum and maximum values are given at 105 °C and –45 °C, respectively.
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