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SST34HF1621-70-4C-LFP 参数 Datasheet PDF下载

SST34HF1621-70-4C-LFP图片预览
型号: SST34HF1621-70-4C-LFP
PDF下载: 下载PDF文件 查看货源
内容描述: 16兆位并行的SuperFlash + 2/4兆位的SRAM ComboMemory [16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory]
分类和应用: 内存集成电路静态存储器
文件页数/大小: 32 页 / 480 K
品牌: SST [ SILICON STORAGE TECHNOLOGY, INC ]
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16 Mbit Concurrent SuperFlash + 2 / 4 Mbit SRAM ComboMemory  
SST34HF1621 / SST34HF1641  
Data Sheet  
i.e., valid data may appear to conflict with either DQ7 or  
Flash Sector/Block-Erase Operation  
DQ6. In order to prevent spurious rejection, if an erroneous  
result occurs, the software routine should include a loop to  
read the accessed location an additional two (2) times. If  
both reads are valid, then the device has completed the  
Write cycle, otherwise the rejection is valid.  
The Sector/Block-Erase operation allows the system to  
erase the device on a sector-by-sector or block-by-block  
basis. The SST34HF1621/1641 offer both Sector-Erase  
and Block-Erase mode. The sector architecture is based  
on uniform sector size of 1 KWord. The Block-Erase mode  
is based on uniform block size of 32 KWord. The Sector-  
Erase operation is initiated by executing a six-byte com-  
mand sequence with Sector-Erase command (30H) and  
sector address (SA) in the last bus cycle. The Block-Erase  
operation is initiated by executing a six-byte command  
sequence with Block-Erase command (50H) and block  
address (BA) in the last bus cycle. The sector or block  
address is latched on the falling edge of the sixth WE#  
pulse, while the command (30H or 50H) is latched on the  
rising edge of the sixth WE# pulse. The internal Erase  
operation begins after the sixth WE# pulse. See Figures 12  
and 13 for timing waveforms. Any commands issued during  
the Sector- or Block-Erase operation are ignored.  
Ready/Busy# (RY/BY#)  
The SST34HF1621/1641 includes a Ready/Busy# (RY/  
BY#) output signal. RY/BY# is actively pulled low during  
internal Program/Erase operation. The status of RY/BY# is  
valid after the rising edge of fourth WE# (or CE#) pulse for  
Program operation. For Sector-, Block- or Bank-Erase, the  
RY/BY# is valid after the rising edge of sixth WE# or (CE#)  
pulse. RY/BY# is an open drain output that allows several  
devices to be tied in parallel to VDD via an external pull up  
resistor. Ready/Busy# is in high impedance whenever OE#  
or CE# is high or RST# is low.  
Flash Data# Polling (DQ7)  
Flash Chip-Erase Operation  
When the SST34HF1621/1641 are in the internal Program  
operation, any attempt to read DQ7 will produce the com-  
plement of the true data. Once the Program operation is  
completed, DQ7 will produce true data. Note that even  
though DQ7 may have valid data immediately following the  
completion of an internal Write operation, the remaining  
data outputs may still be invalid: valid data on the entire  
data bus will appear in subsequent successive Read  
cycles after an interval of 1 µs. During internal Erase opera-  
tion, any attempt to read DQ7 will produce a ‘0’. Once the  
internal Erase operation is completed, DQ7 will produce a  
‘1’. The Data# Polling (DQ7) is valid after the rising edge of  
fourth WE# (or BEF#) pulse for Program operation. For  
Sector-, Block- or Chip-Erase, the Data# Polling (DQ7) is  
valid after the rising edge of sixth WE# (or BEF#) pulse.  
After the completion of a Program operation, Data# Polling  
on DQ7 remains active and the device may not return to the  
Read mode for approximately 1 µs. See Figure 9 for Data#  
Polling (DQ7) timing diagram and Figure 22 for a flowchart.  
The SST34HF1621/1641 provide a Chip-Erase operation,  
which allows the user to erase all unprotected sectors/  
blocks to the “1” state. This is useful when the device must  
be quickly erased.  
The Chip-Erase operation is initiated by executing a six-  
byte command sequence with Chip-Erase command (10H)  
at address 5555H in the last byte sequence. The Erase  
operation begins with the rising edge of the sixth WE# or  
BEF#, whichever occurs first. During the Erase operation,  
the only valid read is Toggle Bit or Data# Polling. See Table  
4 for the command sequence, Figure 11 for timing diagram,  
and Figure 24 for the flowchart. Any commands issued dur-  
ing the Chip-Erase operation are ignored.  
Flash Write Operation Status Detection  
The SST34HF1621/1641 provide one hardware and two  
software means to detect the completion of a Write (Pro-  
gram or Erase) cycle, in order to optimize the system  
Write cycle time. The hardware detection uses the  
Ready/Busy# (RY/BY#) pin. The software detection  
includes two status bits: Data# Polling (DQ7) and Toggle  
Bit (DQ6). The End-of-Write detection mode is enabled  
after the rising edge of WE#, which initiates the internal  
Program or Erase operation.  
Flash Toggle Bit (DQ6)  
During the internal Program or Erase operation, any con-  
secutive attempts to read DQ6 will produce alternating 1s  
and 0s, i.e., toggling between 1 and 0. When the internal  
Program or Erase operation is completed, the DQ6 bit will  
stop toggling. After the completion of a Program operation,  
DQ6 will stop toggling for approximately 1 µs. The device is  
then ready for the next operation. The Toggle Bit (DQ6) is  
valid after the rising edge of fourth WE# (or BEF#) pulse for  
Program operation. For Sector-, Block- or Chip-Erase, the  
The actual completion of the nonvolatile write is asynchro-  
nous with the system; therefore, either a Ready/Busy# (RY/  
BY#), Data# Polling (DQ7) or Toggle Bit (DQ6) read may be  
simultaneous with the completion of the Write cycle. If this  
occurs, the system may possibly get an erroneous result,  
©2001 Silicon Storage Technology, Inc.  
S71172-05-000 10/01 523  
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