CXD1185CQ/CR
Package Outline Unit : mm
CXD1185CQ
64PIN QFP(PLASTIC)
23.9 ± 0.4
+ 0.1
0.15 – 0.05
+ 0.4
20.0 – 0.1
0.15
51
33
52
32
64
20
+ 0.2
0.1 – 0.05
1
19
+ 0.35
2.75 – 0.15
+ 0.15
0.4 – 0.1
1.0
M
0.24
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
EPOXY RESIN
SOLDER/PALLADIUM
PLATING
SONY CODE
EIAJ CODE
QFP-64P-L01
LEAD MATERIAL
PACKAGE MASS
42/COPPER ALLOY
1.5g
QFP064-P-1420
JEDEC CODE
64PIN LQFP (PLASTIC)
CXD1185CR
12.0 ± 0.2
10.0 ± 0.1
48
33
49
32
A
17
(0.22)
64
16
1
+ 0.08
0.18 – 0.03
+ 0.05
0.127 – 0.02
0.5
+ 0.2
1.5 – 0.1
0.13
M
0.1
0.1 ± 0.1
0° to 10°
NOTE: Dimension “ ” does not include mold protrusion.
PACKAGE STRUCTURE
DETAIL A
EPOXY RESIN
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
SOLDER/PALLADIUM
SONY CODE
EIAJ CODE
LQFP-64P-L01
PLATING
LQFP064-P-1010
42/COPPER ALLOY
0.3g
JEDEC CODE
PACKAGE MASS
—35—
SONY [ SONY CORPORATION ]
