Advanced I/O Controller with Motherboard GLUE Logic
Datasheet
Chapter 14 Package Outline
Figure 14.1 - 128 Pin QFP Package Outline, 14x20x2.7 Body, 3.2MM Footprint
Table 14.1 – 128 Pin QFP Package Parameters
MIN
~
NOMINAL
MAX
3.4
REMARKS
A
A1
A2
D
~
Overall Package Height
Standoff
0.05
2.55
23.00
19.90
17.00
13.90
0.09
0.73
~
~
0.5
~
3.05
23.40
20.10
17.40
14.10
0.20
1.03
~
Body Thickness
X Span
23.20
D1
E
20.00
X body Size
17.20
Y Span
E1
H
14.00
Y body Size
~
Lead Frame Thickness
Lead Foot Length
Lead Length
L
0.88
L1
e
1.60
0.50 Basic
Lead Pitch
Lead Foot Angle
Lead Width
0o
0.10
0.08
0.08
~
~
~
~
~
~
7o
0.30
~
θ
W
R1
R2
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
0.30
0.08
ccc
Notes:
1 Controlling Unit: millimeter.
2 Tolerance on the position of the leads is ± 0.04 mm maximum.
3 Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4 Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5 Details of pin 1 identifier are optional but must be located within the zone indicated.
Revision 1.8 SMSC/Non-SMSC Register Sets (02-24-05)
220
SMSC LPC47M182
DATASHEET
SMSC [ SMSC CORPORATION ]
