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EFM32G200F16G-E-QFN32R 参数 Datasheet PDF下载

EFM32G200F16G-E-QFN32R图片预览
型号: EFM32G200F16G-E-QFN32R
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microcontroller,]
分类和应用: 时钟微控制器外围集成电路
文件页数/大小: 205 页 / 3175 K
品牌: SILICON [ SILICON ]
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EFM32G Data Sheet  
TQFP64 Package Specifications  
8. TQFP64 Package Specifications  
8.1 TQFP64 Package Dimensions  
F
C
L
Figure 8.1. TQFP64  
Note:  
1. All dimensions & tolerancing confirm to ASME Y14.5M-1994.  
2. The top package body size may be smaller than the bottom package body size.  
3. Datum 'A,B', and 'B' to be determined at datum plane 'H'.  
4. To be determined at seating place 'C'.  
5. Dimension 'D1' and 'E1' do not include mold protrusions. Allowable protrusion is 0.25mm per side.'D1' and 'E1' are maximum plas-  
tic body size dimension including mold mismatch. Dimension 'D1' and'E1' shall be determined at datum plane 'H'.  
6. Detail of Pin 1 indicatifier are option all but must be located within the zone indicated.  
7. Dimension 'b' does not include dambar protrusion. Allowable dambar protrusion shall not cause thelead width to exceed the maxi-  
mum 'b' dimension by more than 0.08 mm. Dambar can not be locatedon the lower radius or the foot. Minimum space between  
protrusion and an adjacent lead is 0.07 mm.  
8. Exact shape of each corner is optional.  
9. These dimension apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.  
10. All dimensions are in millimeters.  
Table 8.1. QFP64 (Dimensions in mm)  
DIM  
A
MIN  
NOM  
1.10  
MAX  
1.20  
0.15  
1.05  
DIM  
L1  
MIN  
NOM  
MAX  
A1  
A2  
0.05  
0.95  
R1  
R2  
0.08  
0.08  
1.00  
0.20  
silabs.com | Building a more connected world.  
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