6.4 Solder Reflow Profiles
The device is manufactured with Matte-Sn terminations and is compatible with both
standard eutectic and Pb-free solder reflow profiles. MSL qualification was performed
using the maximum Pb-free reflow profile shown in Figure 6-3.
Temperature
60-150 sec.
20-40 sec.
260°C
250°C
3°C/sec max
217°C
6°C/sec max
200°C
150°C
25°C
Time
60-180 sec. max
8
min. max
Figure 6-3: Maximum Pb-free Solder Reflow Profile (Preferred)
6.5 Marking Diagram
Pin 1
Indicator
XXXX - Last 4 digits of Assembly Lot
GS2988
XXXXE3
YYWW - Date Code
YY -
2-digit year
YYWW
WW -
2-digit week number
Figure 6-4: Marking Diagram
6.6 Ordering Information
Table 6-2: Ordering Information
Part Number
Package
Temperature Range
GS2988
GS2988
GS2988-INE3
16-pin QFN
-40°C to +85°C
16-pin QFN
250pc Reel
GS2988-INTE3
GS2988-INTE3Z
-40°C to +85°C
-40°C to +85°C
16-pin QFN
2,500pc Reel
GS2988
GS2988
Final Data Sheet
GENDOC-052131 July 2015
17 of 18
Semtech
www.semtech.com
Rev.6
SEMTECH [ SEMTECH CORPORATION ]
