STK433-130-E
Evaluation Board Characteristics
THD - P
Pd - P
O
O
100
220
7
V
= 44V
V
= 44V
CC
CC
5
200
180
160
140
120
100
80
Rg=600Ω
2ch Drive
(same output rating)
f=1kHz
VG=30dB
VG=30dB
Rg=600Ω
Tc=25°C
3
2
10
7
5
R =6Ω
L
3
2
2ch Drive
1.0
R =6Ω
Ch1 measurement
L
7
5
Tc=25°C
3
2
f=2
0kHz
0.1
7
5
3
60
2
0.01
f=1kHz
40
7
5
3
20
0
2
0.001
0.1
2
3
5 7
2
3
5 7
2
3
5 7
2
3
5 7
1000
2
3
5 7
2
3
5 7
10
2
3
5 7
100
2
3
5 7
1000
1.0
10
100
0.1
1.0
Output power, P /ch - W
Output power, P /ch - W
ITF02723
ITF02724
- fO
O
P
O
P
O
- V
CC
220
200
180
160
140
120
100
80
220
200
180
160
140
120
100
80
R =6Ω
L
2ch Drive
Ch1 measurement
VG=30dB
Rg=600Ω
THD=10%
THD=0.4%
f=1kHz
Tc=25°C
V
= 44V
CC
Rg=600Ω
2ch Drive
60
60
Ch1 measurement
VG=30dB
40
40
R =6Ω
20
0
20
0
L
Tc=25°C
2
3
5 7
2
3
5 7
2
3
5 7
2
3
5 7
100k
10
20
30
40
50
60
70
10
100
1k
10k
Supply voltage, V
CC
-
V
Frequency, f - Hz
ITF02725
ITF02726
[Thermal Design Example for STK433-130-E (R = 6Ω)]
L
The thermal resistance, θc-a, of the heat sink for total power dissipation, Pd, within the hybrid IC is determined as
follows.
Condition 1: The hybrid IC substrate temperature, Tc, must not exceed 125°C.
Pd × θc-a + Ta < 125°C ................................................................................................. (1)
Ta: Guaranteed ambient temperature for the end product
Condition 2: The junction temperature, Tj, of each power transistor must not exceed 150°C.
Pd × θc-a + Pd/N × θj-c + Ta < 150°C .......................................................................... (2)
N: Number of power transistors
θj-c: Thermal resistance per power transistor
However, the power dissipation, Pd, for the power transistors shall be allocated equally among the number of power
transistors.
The following inequalities result from solving equations (1) and (2) for θc-a.
θc-a < (125 − Ta)/Pd ...................................................................................................... (1)'
θc-a < (150 − Ta)/Pd − θj-c/N ........................................................................................ (2)'
Values that satisfy these two inequalities at the same time represent the required heat sink thermal resistance.
When the following specifications have been stipulated, the required heat sink thermal resistance can be determined
from formulas (1)' and (2)'.
• Supply voltage
• Load resistance
• Guaranteed ambient temperature
V
R
Ta
CC
L
No. A1596-7/11
SANYO [ SANYO SEMICON DEVICE ]
