Email:Tech@fosvos.com
HotTel:+86-21-58998693
S3C6410X_UM_REV0.00
S3C6410X66-YB40
PRODUCT OVERVIEW
•
•
•
Support max. 8 surfaces (max. 8 user-defined textures)
API Support: OpenGL ES 1.1 & 2.0, D3D Mobile
Intelligent Host Interface
- 15 input data-types, Vertex Buffer & Vertex Cache
•
•
H/W Clipping (Near & Far)
8-stage five-threaded Shader architecture
•
•
Primitive assembly & hard-wired triangle setup engine
One pixels/cycle hard-wired rasterizer
•
One texturing engine (one bilinear-filtered texel/cycle each)
- Nearest/bilinear/trilinear filtering
- 8-layered multi-texturing support
•
•
Fragment processing: Alpha/Stencil/Z/Dither/Mask/ROP
Memory bandwidth optimization through hierarchical caching
- L1/L2 Texture-caches, Z/Color caches
•
System bus interface
- Host interface: 32-bit AHB (AMBA 2.0)
- Memory Interface: two 64-bit AXI (AMBA 3.0) channels
1.1.6 IMAGE ROTATOR
The S3C6410X microprocessor supports the following Image Rotator features:
•
•
•
Image format: YCbCr 4:2:2 (interleave), YCbCr 4:2:0 (non-interleave), RGB565 and RGB888(unpacked)
Rotate degree: 90, 180, 270, flip vertical and flip horizontal
Image size: 2048x2048
Preliminary product information describe products that are in development,
for which full characterization data and associated errata are not yet available.
Specifications and information herein are subject to change without notice.
1-8
SAMSUNG [ SAMSUNG ]
