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S3C4510B 参数 Datasheet PDF下载

S3C4510B图片预览
型号: S3C4510B
PDF下载: 下载PDF文件 查看货源
内容描述: 三星S3C4510B的16位/ 32位RISC微控制器是一款高性价比,高性能的基于以太网的系统微控制器解决方案。 [Samsungs S3C4510B 16/32-bit RISC microcontroller is a cost-effective, high-performance microcontroller solution for Ethernet-based systems.]
分类和应用: 微控制器以太网
文件页数/大小: 422 页 / 2160 K
品牌: SAMSUNG [ SAMSUNG ]
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S3C4510B  
PRODUCT OVERVIEW  
Table 1-1. S3C4510B Signal Descriptions (Continued)  
Signal  
Pin No.  
Type  
Description  
ADDR[21:0]/  
ADDR[10]/AP (note)  
117–110,  
129–120,  
135–132  
O
Address Bus. The 22-bit address bus, ADDR[21:0], covers the full  
4M word address range of each ROM/SRAM, flash memory,  
DRAM, and the external I/O banks.  
The 23-bit internal address bus used to generate DRAM address.  
The number of column address bits in DRAM bank can be  
programmed 8bits to 11bits use by DRAMCON registers.  
ADDR[10]/AP is the auto precharge control pin. The auto  
precharge command is issued at the same time as burst read or  
burst write by asserting high on ADDR[10]/AP.  
XDATA[31:0]  
141–136,  
154–144,  
166–159,  
175–169  
I/O  
External (bi-directional, 32-bit) Data Bus. The S3C4510B data  
bus supports external 8-bit, 16-bit, and 32-bit bus sizes.  
nRAS[3:0]/  
94, 91, 90,  
89  
O
O
Not Row Address Strobe for DRAM. The S3C4510B supports up  
to four DRAM banks. One nRAS output is provided for each  
bank. nSDCS[3:0] are chip select pins for SDRAM.  
nSDCS[3:0] (note)  
nCAS[3:0]  
98, 97, 96,  
95  
Not column address strobe for DRAM. The four nCAS outputs  
indicate the byte selections whenenver a DRAM bank is  
accessed. nSDRAS is row address strobe signal for SDRAM.  
Latches row addresses on the positive going edge of the SDCLK  
with nSDRAS low. Enable row access and precharge. nSDCAS is  
column address strobe for SDRAM. Latches column addresses  
on the positive going edge of the SDCLK with nSDCAS low.  
Enables column access. CKE is clock enable signal for SDRAM.  
Masks SDRAM system clock, SDCLK to freeze operation from  
the next clock cycle. SDCLK should be enabled at least one cycle  
prior to new command. Disable input buffers of SDRAM for  
power down in standby.  
nCAS[0]/nSDRAS  
nCAS[1]/nSDCAS  
nCAS[2]/CKE (note)  
nDWE  
99  
O
O
DRAM Not Write Enable. This pin is provided for DRAM bank  
write operations. (nWBE[3:0] is used for write operations to the  
ROM/ SRAM/flash memory banks.) .  
nECS[3:0]  
70, 69, 68,  
67  
Not External I/O Chip Select. Four external I/O banks are  
provided for external memory-mapped I/O operations. Each I/O  
bank stores up to 16 Kbytes. nECS signals indicate which of the  
four external I/O banks is selected.  
nEWAIT  
71  
I
Not External Wait. This signal is activated when an external I/O  
device or ROM/SRAM/flash bank 5 needs more access cycles  
than those defined in the corresponding control register.  
When de-assert the nEWAIT, you must synchronize the nEWAIT  
with MCLKO rising edge. If not, memory state machine can get  
into the Wrong State.  
1-7  
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