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S3C4510B 参数 Datasheet PDF下载

S3C4510B图片预览
型号: S3C4510B
PDF下载: 下载PDF文件 查看货源
内容描述: 三星S3C4510B的16位/ 32位RISC微控制器是一款高性价比,高性能的基于以太网的系统微控制器解决方案。 [Samsungs S3C4510B 16/32-bit RISC microcontroller is a cost-effective, high-performance microcontroller solution for Ethernet-based systems.]
分类和应用: 微控制器以太网
文件页数/大小: 422 页 / 2160 K
品牌: SAMSUNG [ SAMSUNG ]
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PRODUCT OVERVIEW  
S3C4510B  
SIGNAL DESCRIPTIONS  
Table 1-1. S3C4510B Signal Descriptions  
Signal  
Pin No.  
Type  
Description  
XCLK  
80  
I
S3C4510B system clock source. If CLKSEL is Low, PLL output  
clock is used as the S3C4510B internal system clock. If  
CLKSEL is High, XCLK is used as the S3C4510B internal  
system clock.  
MCLKO/SDCLK (note)  
CLKSEL  
77  
83  
82  
O
I
System clock out. MCLKO is monitored with some delay as the  
same phase of internal system clock, MCLK(SCLK).  
SDCLK is system clock for SDRAM.  
Clock select. When CLKSEL is '0'(low level), PLL output clock  
can be used as the master clock. When CLKSEL is '1'(high  
level), the XCLK is used as the master clock.  
nRESET  
I
Not reset. nRESET is the global reset input for the S3C4510B.  
To allow a system reset, and for internal digital filtering,  
nRESET must be held to low level for at least 64 master clock  
cycles. Refer to "Figure 3. S3C4510B reset timing diagram" for  
more details about reset timing.  
CLKOEN  
TMODE  
76  
63  
I
I
Clock out enable/disable. (see the pin description for MCLKO.)  
Test Mode. The TMODE bit settings are interpreted as follows:  
'0' = normal operating mode, '1' = chip test mode.  
This TMODE pin also can be used to change MF of PLL.  
To get 5 times internal system clock from external clock, '0'(low  
level) should be assigned to TMODE. If '1'(high level), MF will  
be changed to 6.6  
FILTER  
TCK  
55  
58  
AI  
I
If the PLL is used, 820pF ceramic capacitor should be  
connected between the pin and analog ground(pin # 54).  
JTAG Test Clock. The JTAG test clock shifts state information  
and test data into, and out of, the S3C4510B during JTAG test  
operations. This pin is internally connected pull-down.  
TMS  
TDI  
59  
60  
I
I
JTAG Test Mode Select. This pin controls JTAG test operations  
in the S3C4510B. This pin is internally connected pull-up.  
JTAG Test Data In. The TDI level is used to serially shift test  
data and instructions into the S3C4510B during JTAG test  
operations. This pin is internally connected pull-up.  
TDO  
61  
62  
O
I
JTAG Test Data Out. The TDO level is used to serially shift test  
data and instructions out of the S3C4510B during JTAG test  
operations.  
nTRST  
JTAG Not Reset. Asynchronous reset of the JTAG logic.  
This pin is internally connected pull-up.  
1-6  
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