欢迎访问ic37.com |
会员登录 免费注册
发布采购

BD750L5 参数 Datasheet PDF下载

BD750L5图片预览
型号: BD750L5
PDF下载: 下载PDF文件 查看货源
内容描述: 超低静态电流LDO稳压器 [Ultra Low Quiescent Current LDO Regulator]
分类和应用: 稳压器
文件页数/大小: 21 页 / 614 K
品牌: ROHM [ ROHM ]
 浏览型号BD750L5的Datasheet PDF文件第11页浏览型号BD750L5的Datasheet PDF文件第12页浏览型号BD750L5的Datasheet PDF文件第13页浏览型号BD750L5的Datasheet PDF文件第14页浏览型号BD750L5的Datasheet PDF文件第16页浏览型号BD750L5的Datasheet PDF文件第17页浏览型号BD750L5的Datasheet PDF文件第18页浏览型号BD750L5的Datasheet PDF文件第19页  
Daattaasshheeeett  
BD7xxL5FP-C  
Operational Notes  
1) Absolute maximum ratings  
Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in  
damages to or destruction of the chip. In this event it also becomes impossible to determine the cause of the damage  
(e.g. short circuit, open circuit, etc). Therefore, if any special mode is being considered with values expected to exceed  
the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered.  
2) The electrical characteristics given in this specification may be influenced by conditions such as temperature, supply  
voltage and external components. Transient characteristics should be sufficiently verified.  
3) GND electric potential  
Keep the GND pin potential at the lowest (minimum) level under any operating condition. Furthermore, ensure that,  
including the transient, none of the pin’s voltages are less than the GND pin voltage.  
4) GND wiring pattern  
When both a small-signal GND and a high current GND are present, single-point grounding (at the set standard point) is  
recommended. This in order to separate the small-signal and high current patterns and to ensure that voltage changes  
stemming from the wiring resistance and high current do not cause any voltage change in the small-signal GND. Similarly,  
care must be taken to avoid wiring pattern fluctuations in any connected external component GND.  
5) Inter-pin shorting and mounting errors  
Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in  
damaging the IC. Also, shorts caused by dust entering between the output, input and GND pin may result in damaging  
the IC.  
6) Inspection using the set board  
The IC needs to be discharged after each inspection process as, while using the set board for inspection, connecting a  
capacitor to a low-impedance pin may cause stress to the IC. As a protection from static electricity, ensure that the  
assembly setup is grounded and take sufficient caution with transportation and storage. Also, make sure to turn off the  
power supply when connecting and disconnecting the inspection equipment.  
7) Power dissipation (Pd)  
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in  
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the  
IC is mounted on a 70mm X 70mm X 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,  
increase the board size and copper area to prevent exceeding the Pd rating.  
8) Thermal design  
The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin  
should be allowed for in the thermal design. On the reverse side of the package this product has an exposed heat pad for  
improving the heat dissipation. Use both the front and reverse side of the PCB to increase the heat dissipation pattern as  
far as possible. The amount of heat generated depends on the voltage difference across the input and output, load  
current, and bias current. Therefore, when actually using the chip, ensure that the generated heat does not exceed the  
Pd rating.  
Tjmax: maximum junction temperature=150, Ta: ambient temperature (), θja: junction-to-ambient thermal  
resistance (/W), Pd: power dissipation rating (W), Pc: power consumption (W), VCC: input voltage,  
VOUT: output voltage, IOUT: load current, Ib: bias current  
Power dissipation rating  
Power consumption  
Pd (W)(TjmaxTa) / θja  
Pc (W)(VCC-VOUT)×IOUTVCC×Ib  
www.rohm.com  
TSZ02201-T2T0AN00020-1-2  
2.Oct.2012 Rev.001  
© 2012 ROHM Co., Ltd. All rights reserved.  
15/18  
TSZ2211115001  
 复制成功!