Daattaasshheeeett
BD7xxL5FP-C
●Cautions on PC Board layout , Power Dissipation , Thermal Derating Curves
TO252-3
5
4
3
2
1
0
IC mounted on a ROHM standard board
Board size: 70mm×70mm×1.6mm
Copper area: 7mm×7mm
TO252-3 θja=104.1(℃/W)
1.2
0
25
50
75 100 125 150
Temperature atmosphere Ta(℃)
Figure .25
TO252-3 (Reference data)
5
4
3
2
1
0
IC mounted on a ROHM standard board
Board size: 70mm×70mm×1.6mm
Copper area: 7mm×7mm
③4.8
①: 2-layer PCB (Copper foil area on the reverse side of PCB:15mm×15mm)
②: 2-layer PCB (Copper foil area on the reverse side of PCB:70mm×70mm)
③: 4-layer PCB (Copper foil on the reverse side of PCB:70mm×70mm)
①: θja=67.6℃/W
②3.5
②: θja=35.7℃/W
③: θja=26.0℃/W
①1.85
0
25
50
75 100 125 150
Temperature atmosphere Ta(℃)
Figure .26
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© 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
TSZ02201-T2T0AN00020-1-2
12/18
2.Oct.2012 Rev.001
ROHM [ ROHM ]
