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M38510/13101BPC 参数 Datasheet PDF下载

M38510/13101BPC图片预览
型号: M38510/13101BPC
PDF下载: 下载PDF文件 查看货源
内容描述: [Operational Amplifier, 1 Func, 3000uV Offset-Max, CDIP8, CERAMIC, DIP-8]
分类和应用:
文件页数/大小: 22 页 / 177 K
品牌: RAYTHEON [ RAYTHEON COMPANY ]
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MIL-M-38510/131A  
TABLE II. Electrical test requirements.  
Subgroups (see table III)  
MIL-PRF-38535  
test requirements  
Class S  
devices  
Class B  
devices  
Interim electrical parameters  
Final electrical test parameters  
Group A test requirements  
1
1
1*, 2, 3, 4  
1*, 2, 3, 4  
1, 2, 3, 4, 5,  
6, 7, 8, 12**  
1, 2, 3, 4, 5,  
6, 7  
Group B electrical test parameters when  
using the method 5005 QCI option  
1, 2, 3 and  
table IV delta  
limits  
N/A  
Group C end-point electrical  
parameters  
1, 2, 3 and  
table IV delta delta limits  
limits  
1 and table IV  
Additional electrical subgroups for group C  
periodic inspection  
N/A  
8, 12  
Group D end-point electrical  
parameters  
1, 2, 3  
1
*
PDA applies to subgroup 1.  
** See 4.4.1c  
4. VERIFICATION.  
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or  
as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not  
effect the form, fit, or function as function as described herein.  
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior  
to qualification and quality conformance inspection. The following additional criteria shall apply:  
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified  
in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be  
maintained under document control by the device manufacturer's Technology Review Board (TRB) in  
accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon  
request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in  
accordance with the intent specified in test method 1015 of MIL-STD-883.  
NOTE: If accelerated high-temperature test conditions are used, the device manufacturer shall ensure that at  
least 85 percent of the applied voltage is dropped across the device at temperature. The device is not  
considered functional under accelerated test conditions.  
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical  
parameters test prior to burn-in is optional at the discretion of the manufacturer.  
c. Additional screening for space level product shall be as specified in MIL-PRF-38535.  
d. Reverse bias burn-in shall apply to class S devices only.  
7
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