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JANTXV2N2919L 参数 Datasheet PDF下载

JANTXV2N2919L图片预览
型号: JANTXV2N2919L
PDF下载: 下载PDF文件 查看货源
内容描述: [Small Signal Bipolar Transistor, 0.03A I(C), 60V V(BR)CEO, 2-Element, NPN, Silicon, SIMILAR TO TO-78, 6 PIN]
分类和应用: 晶体管
文件页数/大小: 20 页 / 231 K
品牌: RAYTHEON [ RAYTHEON COMPANY ]
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MIL-PRF-19500/355M
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as
specified herein.
4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not request the performance of
table II tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on
the first inspection lot of this revision to maintain qualification.
4.2.1.1 Group E thermal response. With extremely small junction devices such as this one, a true thermal
impedance cannot be measure, only calculated. While “thermal response” has been substituted for “thermal
impedance” herein, the terms, units and procedure are essentially unchanged. Each supplier shall submit a thermal
response (Z
θJX
) histogram of the entire qualification lot. The histogram data shall be taken prior to the removal of
devices that are atypical for thermal response. Thermal response curves (from Z
θJX
test pulse time to R
θJX
minimum
steady-state time) of the best device in the qual lot and the worst device in the qual lot (that meets the supplier
proposed screening limit), or from the thermal grouping, shall be submitted. The optimal test conditions and
proposed initial thermal response screening limit shall be provided in the qualification report. Data indicating how the
optimal test conditions were derived for Z
θJX
shall also be submitted. The proposed maximum thermal response Z
θJX
screening limit shall be submitted. The qualifying activity may approve a different Z
θJX
limit for conformance
inspection end-point measurements as applicable. Equivalent data, procedures, or statistical process control plans
may be used for part, or all, of the above requirements. The approved thermal response conditions and limit for Z
θJX
shall be used by the supplier in screening and table I, subgroup 2. The approved thermal resistance conditions for
R
θJX
shall be used by the supplier for conformance inspection. For product families with similar thermal
characteristics based on the same physical and thermal die, package, and construction combination (thermal
grouping), the supplier may use the same thermal response curves.
*
4.2.2 JANHC and JANKC die. Qualification shall be in accordance with MIL-PRF-19500.
8