MIL-PRF-19500/355M
4.4.2.3 Group B sample selection. Samples selected from group B inspection shall meet all of the following
requirements:
a. For JAN, JANTX, and JANTXV samples shall be selected randomly from a minimum of three wafers (or
from each wafer in the lot) from each wafer lot. For JANS, samples shall be selected from each inspection lot.
See MIL-PRF-19500.
b. Shall be chosen from an inspection lot that has been submitted to and passed table I, subgroup 2,
conformance inspection. When the final lead finish is solder or any plating prone to oxidation at high
temperature, the samples for life test (subgroups B4 and B5 for JANS, and group B for JAN, JANJ, JANTX,
and JANTXV) may be pulled prior to the application of final lead finish.
4.4.3 Group C inspection, Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VII of MIL-PRF-19500, and in 4.4.3.1 (JANS) and 4.4.3.2 (JAN, JANTX, and JANTXV)
herein for group C testing. Electrical measurements (end-points) and delta requirements shall be in accordance with
table I, subgroup 2 and 4.5.8 herein.
*
4.4.3.1 Group C inspection, table E-VII (JANS) of MIL-PRF-19500.
Subgroup Method Condition
C2
2036
Test condition E, not applicable to surface mount.
RθJA and RθJC only, as applicable (see 1.3) and 4.3.2.
C5
C6
3131
1026
1,000 hours at VCB = 10 V dc; power shall be applied to achieve TJ = +150°C minimum and
a minimum of PD = 75 percent of maximum rated PT as defined in 1.3 n = 45, c = 0.
The sample size may be increased and the test time decreased as long as the devices are
stressed for a total of 45,000 device hours minimum, and the actual time of test is at least
340 hours.
*
4.4.3.2 Group C inspection, table E-VII (JAN, JANTX, and JANTXV) of MIL-PRF-19500.
Subgroup Method Condition
C2
2036
3131
Test condition E, not applicable to surface mount.
C5
C6
RθJA and RθJC only, as applicable (see 1.3) and 4.3.2.
Not applicable.
4.4.3.3 Group C sample selection. Samples for subgroups in group C shall be chosen at random from any
inspection lot containing the intended package type and lead finish procured to the same specification which is
submitted to and passes table I tests herein for conformance inspection. When the final lead finish is solder or any
plating prone to oxidation at high temperature, the samples for C6 life test may be pulled prior to the application of
final lead finish. Testing of a subgroup using a single device type enclosed in the intended package type shall be
considered as complying with the requirements for that subgroup.
4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-IX of MIL-PRF-19500 and as specified in table II herein. Electrical measurements (end-
points) shall be in accordance with table I, subgroup 2 herein; delta measurements shall be in accordance with the
applicable steps of 4.5.8.
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RAYTHEON [ RAYTHEON COMPANY ]
