QN8007B/8007LB
Figure 15: Reflow Temperature Profile
9.3 Maximum Reflow Times
All package reliability tests were performed and passed with a pre-condition procedure that repeat a reflow profile, which
conforms to the requirements in Section 9.2, three (3) times.
CONTACT INFORMATION
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Web: www.quinticcorp.com
Fax: +86 (10) 8215-1570
Web: www.quinticcorp.com
Quintic Microelectronics and Quintic are trademarks of Quintic Corporation. All Rights Reserved.
Rev 2.09 (11/09)
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Copyright ©2009 by Quintic Corporation
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
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