QN8007B/8007LB
9 SOLDER REFLOW PROFILE
9.1 Package Peak Reflow Temperature
QN800X is assembled in a lead-free QFN24 package. Since the geometrical size of QN800X is 4 mm 4 mm 0.85 mm,
the volume and thickness is in the category of volume<350 mm3 and thickness<1.6 mm in Table 4-2 of IPC/JEDEC J-STD-
020C. The peak reflow temperature is:
Tp 260o C
The temperature tolerance is +0oC and -5oC. Temperature is measured at the top of the package.
9.2 Classification Reflow Profiles
Profile Feature
Specification*
3°C/second max.
150°C
Average Ramp-Up Rate (tsmax to tP)
Temperature Min (Tsmin)
Pre-heat:
Temperature Max (Tsmax)
Time (ts)
200°C
60-180 seconds
Time
maintained
above:
Temperature (TL)
Time (tL)
217°C
60-150 seconds
260°C
Peak/Classification Temperature (Tp)
Time within 5°C of Actual Peak
Temperature (tp)
20-40 seconds
Ramp-Down Rate
6°C/second max.
8 minutes max.
Time 25°C to Peak Temperature
*Note: All temperatures are measured at the top of the package.
Rev 2.09 (11/09)
Confidential A
Copyright ©2009 by Quintic Corporation
Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).
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