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HYB18T512400BF-5 参数 Datasheet PDF下载

HYB18T512400BF-5图片预览
型号: HYB18T512400BF-5
PDF下载: 下载PDF文件 查看货源
内容描述: 512兆位双数据速率 - 双SDRAM的 [512-Mbit Double-Data-Rate-Two SDRAM]
分类和应用: 内存集成电路动态存储器双倍数据速率
文件页数/大小: 57 页 / 2915 K
品牌: QIMONDA [ QIMONDA AG ]
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HYB18T512xxxBF–[2.5…5]  
512-Mbit Double-Data-Rate-Two SDRAM  
7) For each of the terms, if not already an integer, round to the next highest integer. tCK refers to the application clock period.  
WR refers to the WR parameter stored in the MR.  
8) The clock frequency is allowed to change during self-refresh mode or precharge power-down mode. In case of clock  
frequency change during power-down, a specific procedure is required.  
9) Consists of data pin skew and output pattern effects, and p-channel to n-channel variation of the output drivers as well as  
output Slew Rate mis-match between DQS / DQS and associated DQ in any given cycle.  
10) MIN (tCL, tCH) refers to the smaller of the actual clock low time and the actual clock high time as provided to the device (i.e.  
this value can be greater than the minimum specification limits for tCL and tCH).  
11) The tHZ, tRPST and tLZ, tRPRE parameters are referenced to a specific voltage level, which specify when the device output is  
no longer driving (tHZ, tRPST), or begins driving (tLZ, tRPRE). tHZ and tLZ transitions occur in the same access time windows as  
valid data transitions.These parameters are verified by design and characterization, but not subject to production test.  
12) The Auto-Refresh command interval has be reduced to 3.9 µs when operating the DDR2 DRAM in a temperature range  
between 85 °C and 95 °C.  
13) 0 °CTCASE 85 °C  
14) 85 °C < TCASE 95 °C  
15) A maximum of eight Auto-Refresh commands can be posted to any given DDR2 SDRAM device.  
16) tRP(A) for a Precharge-All command for an 8 bank device is equal to tRP + 1tCK, where tRP are the values for a single bank  
precharge.  
17) The tRRD timing parameter depends on the page size of the DRAM organization. See Chapter 1  
18) The maximum limit for the tWPST parameter is not a device limit. The device operates with a greater value for this parameter,  
but system performance (bus turnaround) degrades accordingly.  
19) WR must be programmed to fulfill the minimum requirement for the tWR timing parameter, where  
WRMIN[cycles] = tWR(ns)/tCK(ns) rounded up to the next integer value. tDAL = WR + (tRP/tCK). For each of the terms, if not  
already an integer, round to the next highest integer. tCK refers to the application clock period. WR refers to the WR  
parameter stored in the MRS.  
20) Minimum tWTR is two clocks when operating the DDR2-SDRAM at frequencies ≤ 200 ΜΗz.  
21) User can choose two different active power-down modes for additional power saving via MRS address bit A12. In “standard  
active power-down mode” (MR, A12 = “0”) a fast power-down exit timing tXARD can be used. In “low active power-down  
mode” (MR, A12 =”1”) a slow power-down exit timing tXARDS has to be satisfied.  
Table 42  
Timing Parameter by Speed Grade - DDR2–667  
Parameter  
Symbol  
DDR2–667  
Unit  
Note1)2)3)4)5)  
6)  
Min.  
–450  
2
Max.  
+450  
DQ output access time from CK / CK  
CAS A to CAS B command period  
CK, CK high-level width  
tAC  
ps  
tCCD  
tCH  
tCKE  
tCL  
tCK  
tCK  
tCK  
tCK  
tCK  
0.45  
3
0.55  
CKE minimum high and low pulse width  
CK, CK low-level width  
0.45  
WR + tRP  
0.55  
7)  
Auto-Precharge write recovery + precharge tDAL  
time  
8)  
Minimum time clocks remain ON after CKE tDELAY  
asynchronously drops LOW  
tIS + tCK + tIH  
––  
ns  
ps  
ps  
DQ and DM input hold time (differential data tDH(base)  
strobe)  
175  
––  
DQ and DM input hold time (single ended  
data strobe)  
tDH1(base)  
DQ and DM input pulse width (each input)  
DQS output access time from CK / CK  
tDIPW  
0.35  
–400  
0.35  
tCK  
ps  
tDQSCK  
+400  
DQS input low (high) pulse width (write cycle) tDQSL,H  
tCK  
Internet Data Sheet  
41  
Rev. 1.05, 2007-01  
03292006-YBYM-WG0Z  
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