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HYB18T1G160AF-5 参数 Datasheet PDF下载

HYB18T1G160AF-5图片预览
型号: HYB18T1G160AF-5
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 64MX16, 0.6ns, CMOS, PBGA92, ROHS COMPLIANT, PLASTIC, TFBGA-92]
分类和应用: 时钟动态存储器双倍数据速率内存集成电路
文件页数/大小: 53 页 / 2560 K
品牌: QIMONDA [ QIMONDA AG ]
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HYB18T1G[40/80/16]0AF(L)–[3S/3.7/5]  
1-Gbit DDR2 SDRAM  
Currents Specifications and Conditions  
6
Currents Specifications and Conditions  
For Double-Data-Rate-Two SDRAMs described in this data sheet the maximum IDD values are listed in Table 43.  
The measurement conditions for IDD characteristics are listed in Table 43, general timing conditions used are listed  
in Table 44. At the end of this chapter the on-die-termination currents are defined.  
Table 31  
IDD Measurement Conditions  
Parameter  
Symbol Note  
1)2)3)4)5)6)  
Operating Current - One bank Active - Precharge  
CK = tCK(IDD), tRC = tRC(IDD), tRAS = tRAS.MIN(IDD), CKE is HIGH, CS is HIGH between valid  
IDD0  
t
commands. Address and control inputs are switching; Databus inputs are switching.  
Operating Current - One bank Active - Read - Precharge  
IDD1  
I
OUT = 0 mA, BL = 4, tCK = tCK(IDD), tRC = tRC(IDD), tRAS = tRAS.MIN(IDD), tRCD = tRCD(IDD), AL = 0,  
CL = CL(IDD); CKE is HIGH, CS is HIGH between valid commands. Address and control  
inputs are switching; Databus inputs are switching.  
Precharge Power-Down Current  
IDD2P  
All banks idle; CKE is LOW; tCK = tCK(IDD);Other control and address inputs are stable; Data  
bus inputs are floating.  
Precharge Standby Current  
IDD2N  
All banks idle; CS is HIGH; CKE is HIGH; tCK = tCK(IDD); Other control and address inputs are  
switching, Data bus inputs are switching.  
Precharge Quiet Standby Current  
All banks idle; CS is HIGH; CKE is HIGH; tCK = tCK(IDD); Other control and address inputs are  
stable, Data bus inputs are floating.  
IDD2Q  
IDD3P(0)  
IDD3P(1)  
IDD3N  
Active Power-Down Current  
All banks open; tCK = tCK(IDD), CKE is LOW; Other control and address inputs are stable; Data  
bus inputs are floating. MRS A12 bit is set to “0” (Fast Power-down Exit).  
Active Power-Down Current  
All banks open; tCK = tCK(IDD), CKE is LOW; Other control and address inputs are stable, Data  
bus inputs are floating. MRS A12 bit is set to 1 (Slow Power-down Exit);  
Active Standby Current  
All banks open; tCK = tCK(IDD); tRAS = tRAS.MAX(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH  
between valid commands. Address inputs are switching; Data Bus inputs are switching;  
Operating Current  
IDD4R  
Burst Read: All banks open; Continuous burst reads; BL = 4; AL = 0, CL = CL(IDD)  
;
t
CK = tCK(IDD); tRAS = tRAS.MAX.(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH between valid  
commands. Address inputs are switching; Data Bus inputs are switching; IOUT = 0 mA.  
Operating Current  
IDD4W  
IDD5B  
IDD5D  
Burst Write: All banks open; Continuous burst writes; BL = 4; AL = 0, CL = CL(IDD)  
;
t
CK = tCK(IDD); tRAS = tRAS.MAX(IDD), tRP = tRP(IDD); CKE is HIGH, CS is HIGH between valid  
commands. Address inputs are switching; Data Bus inputs are switching;  
Burst Refresh Current  
t
CK = tCK(IDD), Refresh command every tRFC = tRFC(IDD) interval, CKE is HIGH, CS is HIGH  
between valid commands, Other control and address inputs are switching, Data bus inputs  
are switching.  
Distributed Refresh Current  
t
CK = tCK(IDD), Refresh command every tREFI = 7.8 µs interval, CKE is LOW and CS is HIGH  
between valid commands, Other control and address inputs are switching, Data bus inputs  
are switching.  
Internet Data Sheet  
32  
Rev. 1.31, 2007-01  
03292006-1X3H-6X8S  
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