RM7965A-900UI 900 MHz 64-bit Microprocessor Data Sheet
17 Packaging and Pinout Information
17.1 256-pin CSBGA Package Diagram
(4X)
aaa
A
D
A1 BALL CORNER
I.D. INDICATOR
Ø
Ø
eee
f f f
M
M
C
C
A B
D1,M
A1 BALL
CORNER
b
R2.5 MAX. (4X)
E1,N
E
A
e
0.25 MIN.
B
ENCAPSULATION EDGE
A
TOP
VIEW
BOTTOM VIEW
DETAIL A
A
A2
bbb
C
A1
0.10 MIN
ddd
C
C
SIDE VIEW
SEATING PLANE
SECTION A-A
DETAIL A
NOTES: 1) ALL DIMENSIONS IN MILLIMETERS
2) DIMENSION aaa DENOTES PACKAGE PROFILE
3) DIMENSION bbb DENOTES PARALLELISM
4) DIMENSION ddd DENOTES COPLANARITY
5) DIAMETER OF SOLDER MASK OPENING IS 0.58 MM (SMD)
0~0.32 MAX.
6) PACKAGE COMPLIANT TO JEDEC REGISTERED OUTLINE MO-192
VARIATION BAL-2 WITH EXCEPTION OF PROFILE TOLERANCE,
COPLANARITY, AND MAXIMUM OVERALL THICKNESS
PACKAGE TYPE: 256 THERMALLY ENHANCED BALL GRID ARRAY - CSBGA+
BODY SIZE: 27 x 27 x 1.62mm
Dim.
A
A1
A2
D
D1
E
E1
M, N
e
b
aaa
bbb
ddd
eee
f f f
Min.
1.47
0.55
0.65
0.75
0.92
-
-
-
-
-
-
-
0.75
-
-
-
-
-
-
-
-
-
-
-
Nom. 1.62
Max. 1.77
0.97 27.00 24.13 27.00 24.13 20x20 1.27
BSC
BSC
BSC
BSC
BSC
1.02
-
-
-
-
-
-
0.10
0.25
0.15
0.30
0.15
Proprietary and Confidential to PMC-Sierra, Inc., and for its customers’ internal use.
Document No.: PMC-2100294, Issue 2
68
PMC [ PMC-SIERRA, INC ]
