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RM7965A-900UI 参数 Datasheet PDF下载

RM7965A-900UI图片预览
型号: RM7965A-900UI
PDF下载: 下载PDF文件 查看货源
内容描述: [Microprocessor, 64-Bit, 900MHz, CMOS, PBGA256, 27 X 27 MM, 1.62 MM HEIGHT, MO-192BAL-2, CSBGA-256]
分类和应用: 时钟外围集成电路
文件页数/大小: 74 页 / 508 K
品牌: PMC [ PMC-SIERRA, INC ]
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RM7965A-900UI 900 MHz 64-bit Microprocessor Data Sheet  
16 Thermal Information  
This product is designed to operate over a wide temperature range when used with a heat sink  
and is suited for commercial applications such as central office equipment.  
Maximum long-term operating junction temperature (TJ) to ensure adequate  
long-term life.  
88°C  
Minimum ambient temperature (TA)  
0°C  
Table 31 Device Compact Model2  
Ambient  
900 MHz  
SA  
0.27  
6.52  
13.23  
Junction-to-Case Thermal Resistance, JC  
Junction-to-Board Thermal Resistance, JB  
JA (°C/W) (without heat sink)  
Heat Sink  
CS  
Table 32 Heat Sink Requirements  
Device  
Compact  
Model  
Case  
4
SA+CS  
The sum of SA + CS must be less than or equal to:  
[(105 - TA) / PD ] - JC ] °C/W  
JC  
where:  
Junction  
JB  
TA is the ambient temperature at the heat sink  
location  
PD is the operating power dissipated in the package5  
Board  
SA and CS are required for long-term operation  
Notes:  
1. The minimum ambient temperature requirement for Central Office Equipment approximates the  
minimum ambient temperature requirement for Commercial Equipment.  
2. Short-term is used as defined in Telcordia Technologies Generic Requirements GR-63-Core; for more  
information about the GR-63-CORE standard, see Telcordia Technologies. Network Equipment-  
Building System (NEBS) Requirements: Physical Protection: Telcordia Technologies Generic  
Requirements GR-63-CORE. Issue 1. October 1995.  
3. JC, the junction-to-case thermal resistance, is a measured nominal value plus two sigma. JB, the  
junction-to-board thermal resistance, is obtained by simulating conditions described in JEDEC  
Standard JESD 51-8; for more information about the JESD51-8 standard, see Electronic Industries  
Alliance 1999. Integrated Circuit Thermal Test Method Environmental Conditions -Junction-to-Board:  
JESD51-8. October 1999.  
4.  
SA is the thermal resistance of the heat sink to ambient. CS is the thermal resistance of the heat sink  
attached material. The maximum SA required for the airspeed at the location of the device in the  
system with all components in place.  
5. Power depends upon the operating mode. To obtain power information, refer to the column under  
thermal in Table 29.  
Proprietary and Confidential to PMC-Sierra, Inc., and for its customers’ internal use.  
Document No.: PMC-2100294, Issue 2  
67  
 
 
 
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