Philips Semiconductors
Product specification
High speed CAN transceiver
TJA1041A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
no time limit
MIN.
−0.3
MAX.
+6
UNIT
VCC
DC voltage on pin VCC
V
V
V
V
V
V
V
V
V
V
V
V
operating range
no time limit
4.75
−0.3
2.8
5.25
VI/O
DC voltage on pin VI/O
DC voltage on pin VBAT
+6
operating range
no time limit
5.25
VBAT
−0.3
5
+40
operating range
load dump
27
−
40
VTXD
VRXD
VSTB
VEN
DC voltage on pin TXD
DC voltage on pin RXD
DC voltage on pin STB
DC voltage on pin EN
DC voltage on pin ERR
DC voltage on pin INH
DC voltage on pin WAKE
DC current on pin WAKE
DC voltage on pin CANH
DC voltage on pin CANL
DC voltage on pin SPLIT
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−0.3
−
VI/O + 0.3
VI/O + 0.3
VI/O + 0.3
VI/O + 0.3
VI/O + 0.3
VERR
VINH
VBAT + 0.3 V
VBAT + 0.3 V
VWAKE
IWAKE
VCANH
VCANL
VSPLIT
Vtrt
−15
+40
+40
+40
+200
mA
0 < VCC < 5.25 V; no time limit
0 < VCC < 5.25 V; no time limit
0 < VCC < 5.25 V; no time limit
−27
−27
−27
V
V
V
V
transient voltages on pins CANH, according to ISO 7637; see Fig.6 −200
CANL, SPLIT and VBAT
Vesd
electrostatic discharge voltage
Human Body Model (HBM);
note 1
pins CANH, CANL and SPLIT −6
+6
kV
kV
V
all other pins
−4
+4
Machine Model (MM); note 2
note 3
−200
−40
−55
+200
+150
+150
Tvj
virtual junction temperature
storage temperature
°C
°C
Tstg
Notes
1. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor (6 kV level with pin GND connected to
ground).
2. Equivalent to discharging a 200 pF capacitor via a 0.75 µH series inductor and a 10 Ω series resistor.
3. Junction temperature in accordance with IEC 60747-1. An alternative definition is: Tvj = Tamb + P × Rth(vj-amb), where
Rth(vj-amb) is a fixed value. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient
temperature (Tamb).
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
Rth(j-s)
thermal resistance from junction to ambient in SO14 package in free air
120
40
K/W
K/W
thermal resistance from junction to substrate of bare die
11
in free air
2004 Feb 20
NXP [ NXP ]
