TDA8922B
Philips Semiconductors
2 × 50 W class-D power amplifier
13.8 Application schematic
Notes to the application schematic:
• A solid ground plane around the switching amplifier is necessary to prevent emission.
• 100 nF capacitors must be placed as close as possible to the power supply pins of the
TDA8922BTH.
• The internal heat spreader of the TDA8922BTH is internally connected to VSS
.
• The external heatsink must be connected to the ground plane.
• Use a thermal conductive electrically non-conductive Sil-Pad® between the backside
of the TDA8922BTH and a small external heatsink.
• The differential inputs enable the best system level audio performance with
unbalanced signal sources. In case of hum due to floating inputs, connect the
shielding or source ground to the amplifier ground. Jumpers J1 and J2 are open on
set level and are closed on the stand-alone demo board.
• Minimum total required capacity per power supply line is 3300 µF.
9397 750 13357
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data sheet
Rev. 01 — 1 October 2004
19 of 32
NXP [ NXP ]
