NCN8024R
PACKAGE DIMENSIONS
SOIC−28 WB
CASE 751F−05
ISSUE H
−X−
D
28
15
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBER
PR5OTRUSION SHALL NOT BE 0.13 TOTATL IN
EXCESS OF B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
H
E
M
M
Y
0.25
−Y−
1
14
PIN 1 IDENT
MILLIMETERS
DIM MIN
MAX
2.65
0.29
0.49
0.32
18.05
7.60
A
A1
B
2.35
0.13
0.35
0.23
17.80
7.40
A
L
C
0.10
D
E
−T− SEATING
G
A1
G
H
1.27 BSC
PLANE
C
10.05
0.41
0
10.55
0.90
8
B
L
M
M
M
S
S
Y
_
_
0.025
T X
SOLDERING FOOTPRINT*
8X
11.00
28X
1.30
1
28
28X
0.52
1.27
PITCH
14
15
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
14
ONSEMI [ ONSEMI ]
