MC54/74HC390
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC PACKAGE
CASE 620–10
ISSUE V
–A
–
NOTES:
16
1
9
8
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
–B
–
4. DIM F MAY NARROW TO 0.76 (0.030) WHERE
THE LEAD ENTERS THE CERAMIC BODY.
L
C
INCHES
MILLIMETERS
DIM
A
B
C
D
E
MIN
MAX
0.785
0.295
0.200
0.020
MIN
19.05
6.10
—
0.39
1.27 BSC
MAX
19.93
7.49
5.08
0.50
0.750
0.240
—
0.015
0.050 BSC
–T
SEAT
–
ING
N
K
PLANE
F
G
J
K
L
M
N
0.055
0.100 BSC
0.008
0.125
0.065
1.40
2.54 BSC
0.21
3.18
1.65
E
M
0.015
0.170
0.38
4.31
J 16 PL
F
G
0.300 BSC
15
0.040
7.62 BSC
15
1.01
0.51
M
S
0.25 (0.010)
T
B
D 16 PL
°
°
0°
0°
M
S
0.25 (0.010)
T
A
0.020
N SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
NOTES:
–A
–
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
16
9
B
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
1
8
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
MIN
MAX
0.770
0.270
0.175
0.021
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
F
C
L
0.740
0.250
0.145
0.015
0.040
S
0.070
1.77
SEATING
PLANE
–T
0.100 BSC
0.050 BSC
0.015
0.130
0.305
2.54 BSC
1.27 BSC
0.38
3.30
7.74
–
M
K
0.008
0.110
0.295
0.21
2.80
7.50
H
J
G
D 16 PL
M
S
0°
10°
0°
10°
M
M
0.25 (0.010)
T
A
0.020
0.040
0.51
1.01
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A
–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
16
9
8
–B
–
P 8 PL
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
M
M
0.25 (0.010)
B
1
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
G
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
MIN
9.80
3.80
1.35
0.35
0.40
MAX
10.00
4.00
1.75
0.49
MIN
MAX
0.393
0.157
0.068
0.019
0.049
0.386
0.150
0.054
0.014
0.016
0.050 BSC
0.008
0.004
F
K
R X 45°
C
1.25
1.27 BSC
–T
0.19
0.10
0.25
0.25
0.009
0.009
J
SEAT
–
ING
M
K
PLANE
D 16 PL
M
P
R
0
5.80
0.25
°
7
6.20
0.50
°
0
°
7°
0.244
0.019
0.229
0.010
M
S
S
0.25 (0.010)
T
B
A
High–Speed CMOS Logic Data
DL129 — Rev 6
7
MOTOROLA
ONSEMI [ ONSEMI ]
