LPC2212/2214
NXP Semiconductors
16/32-bit ARM microcontrollers
9. Dynamic characteristics
Table 9.
Dynamic characteristics
Tamb = −40 °C to +85 °C for industrial applications; VDD(1V8), VDD(3V3) over specified ranges.[1]
Symbol
External clock
fosc
Parameter
Conditions
Min
Typ
Max
Unit
oscillator frequency
supplied by an external
oscillator (signal generator)
1
1
-
-
50
30
MHz
MHz
external clock frequency
supplied by an external
crystal oscillator
external clock frequency if
on-chip PLL is used
10
10
-
-
25
25
MHz
MHz
external clock frequency if
on-chip bootloader is used
for initial code download
Tcy(clk)
tCHCX
tCLCX
tCLCH
tCHCL
clock cycle time
clock HIGH time
clock LOW time
clock rise time
clock fall time
20
-
-
-
-
-
1000
ns
ns
ns
ns
ns
T
T
-
cy(clk) × 0.4
-
cy(clk) × 0.4
-
5
5
-
Port pins (except P0[2] and P0[3])
tr
tf
rise time
-
-
10
10
-
-
ns
ns
fall time
I2C-bus pins (P0[2] and P0[3])
[2]
tf fall time
VIH to VIL
20 + 0.1 × Cb
-
-
ns
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Bus capacitance Cb in pF, from 10 pF to 400 pF.
LPC2212_2214_4
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 04 — 3 January 2008
36 of 45
NXP [ NXP ]
