LPC2210/2220
NXP Semiconductors
16/32-bit ARM microcontrollers
• Programmable clocks allow versatile rate control.
• Bidirectional data transfer between masters and slaves.
• Multi-master bus (no central master).
• Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus may be used for test and diagnostic purposes.
6.14 SPI serial I/O controller
The LPC2210/2220 each contain two SPIs. The SPI is a full duplex serial interface,
designed to be able to handle multiple masters and slaves connected to a given bus. Only
a single master and a single slave can communicate on the interface during a given data
transfer. During a data transfer the master always sends a byte of data to the slave, and
the slave always sends a byte of data to the master.
6.14.1 Features
• Compliant with SPI specification.
• Synchronous, serial, full duplex, communication.
• Combined SPI master and slave.
• Maximum data bit rate of one eighth of the input clock rate.
6.15 SSP controller
This peripheral is available in LPC2210/01 and LPC2220 only.
6.15.1 Features
• Compatible with Motorola’s SPI, Texas Instrument’s 4-wire SSI, and National
Semiconductor’s Microwire buses.
• Synchronous serial communication.
• Master or slave operation.
• 8-frame FIFOs for both transmit and receive.
• 4 bits to 16 bits per frame.
6.15.2 Description
The SSP is a controller capable of operation on a SPI, 4-wire SSI, or Microwire bus. It can
interact with multiple masters and slaves on the bus. Only a single master and a single
slave can communicate on the bus during a given data transfer. Data transfers are in
principle full duplex, with frames of 4 bits to 16 bits of data flowing from the master to the
slave and from the slave to the master.
LPC2210_2220_6
© NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 11 December 2008
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