PBSS8110X
NXP Semiconductors
100 V, 1 A NPN low VCEsat (BISS) transistor
11. Soldering
4.75
2.25
2.00
1.90
1.20
solder lands
solder resist
0.85
0.20
1.20
1.20
occupied area
1.70
solder paste
4.60
4.85
Dimensions in mm
0.50
1.20
1.00
(3x)
3
2
1
msa442
0.60 (3x)
0.70 (3x)
3.70
3.95
Reflow soldering is the only recommended soldering method
Fig 19. Reflow soldering footprint SOT89 (SC-62/TO-243)
12. Mounting
32 mm
30 mm
32 mm
20
2.5 mm
1 mm
mm
40
mm
40
mm
3 mm
1 mm
2.5 mm
2.5 mm
0.5 mm
1 mm
0.5 mm
5 mm
5 mm
3.96 mm
3.96 mm
1.6 mm
001aaa234
1.6 mm
001aaa235
Fig 20. FR4 PCB, standard footprint
Fig 21. FR4 PCB, mounting pad for
collector 6cm2
PBSS8110X_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 11 December 2009
12 of 15
NEXPERIA [ Nexperia ]
