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SFELA10M7HA00-B0 参数 Datasheet PDF下载

SFELA10M7HA00-B0图片预览
型号: SFELA10M7HA00-B0
PDF下载: 下载PDF文件 查看货源
内容描述: 陶瓷滤波器( CERAFIL )的FM接收器 [Ceramic Filters (CERAFIL) for FM Receivers]
分类和应用: 陶瓷滤波器
文件页数/大小: 57 页 / 981 K
品牌: MURATA [ muRata ]
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Please read CAUTION and Notice in this catalog for safety. This catalog has only typical specifications. Therefore you are requested  
to approve our product specification or to transact the approval sheet for product specification, before your ordering.  
P61E7.pdf 01.10.17  
Chip Type Discriminators CDACV Series Notice  
Notice (soldering and mounting)  
1. Standard Reflow Soldering Condition  
(1) Reflow  
5sec.  
240  
230  
Gradual  
Cooling  
150  
60  
30  
Time (sec.)  
(2) Soldering Iron  
Lead terminal is directly contacted with the tip of  
soldering iron of 280±5˚C for 3.0±0.5 seconds.  
2. Wash  
The component cannot be withstand washing.  
Notice (handling)  
1. The component may be damaged if excess mechanical  
stress is applied to it mounted on the printed circuit  
board.  
[Component direction]  
Put the  
component  
lateral to the  
direction in  
which stress  
acts.  
2. Design layout of components on the PC board to  
minimize the stress imposed on the warp or flexure of the  
board.  
[Component layout close to board]  
3. After installing chips, if solder is excessively applied to  
the circuit board, mechanical stress will cause destruction  
resistance characteristics to lower. To prevent this, be  
extremely careful in determining shape and dimension  
before designing the circuit board diagram.  
4. When the positioning claws and pick up nozzle are worn,  
the load is applied to the chip while positioning is  
concentrated to one positioning accuracy, etc. Careful  
checking and maintenance are necessary to prevent  
unexpected trouble.  
Perforation  
B
Susceptibility to  
stress is in the order  
of : A>C>B  
C
A
Slit  
11  
5. When correcting chips with a soldering iron, the tip of the  
soldering iron should not directly touch the chip  
component. Depending on the soldering conditions, the  
effective area of terminations may be reduced. the use of  
solder containing Ag should be done to prevent the  
electrode erosion.  
6. Do not clean or wash the component as it is not  
hermetically sealed.  
7. In case of covering discriminator with over coat,  
conditions such as material of resin, cure temperature,  
and so on should be evaluated well.  
8. Accurate test circuit values are required to measure  
electrical characteristics.  
It may be a cause of mis-correlation if there is any  
deviation, especially stray capacitance, from the test  
circuit in the specification.  
41  
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