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SFELA10M7HA00-B0 参数 Datasheet PDF下载

SFELA10M7HA00-B0图片预览
型号: SFELA10M7HA00-B0
PDF下载: 下载PDF文件 查看货源
内容描述: 陶瓷滤波器( CERAFIL )的FM接收器 [Ceramic Filters (CERAFIL) for FM Receivers]
分类和应用: 陶瓷滤波器
文件页数/大小: 57 页 / 981 K
品牌: MURATA [ muRata ]
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Please read CAUTION and Notice in this catalog for safety. This catalog has only typical specifications. Therefore you are requested  
to approve our product specification or to transact the approval sheet for product specification, before your ordering.  
P61E7.pdf 01.10.17  
Chip Type Discriminators CDSCA Series Notice  
Notice (Soldering and Mounting)  
1. Standard Reflow Soldering Condition  
(1) Reflow  
5 sec  
260  
240  
Gradual  
Cooling  
150  
60  
60  
Time (sec.)  
(2) Soldering Iron  
Lead terminal is directly contacted with the tip of  
soldering iron of +280±5°C for 3.0 seconds±0.5 seconds.  
2. Wash  
The component cannot be withstand washing.  
Notice (Handling)  
1. The component mounted on the PCB may be damaged if  
[Component direction]  
excess mechanical stress is applied.  
Put the  
component  
laterally to the  
direction in  
which stress  
acts.  
2. Layout the components on the PCB to minimize the  
stress imposed by the warp or flexure of the board.  
3. After installing components, if solder is excessively  
applied to the circuit board, mechanical stress will cause  
[Component layout close to board]  
destruction resistance characteristics to be lower. To  
prevent this, be extremely careful in determining shape  
and dimension before designing the circuit board diagram.  
4. When the positioning claw or pick up nozzle are worn, the  
excess load is applied to the components while  
positioning or placing are performed. Careful checking  
and maintenance are necessary to prevent unexpected  
trouble.  
Perforation  
B
Susceptibility to  
stress is in the order  
of : A>C>B  
C
A
Slit  
5. When correcting component's position with a soldering  
iron, the tip of the soldering iron should not directly touch  
the chip component. Depending on the soldering  
conditions, the effective area of terminations may be  
reduced. The use of solder containing Ag should be  
considerd to prevent the electrode erosion.  
6. Do not clean or wash the component as it is not  
hermetically sealed.  
12  
7. In case of overcoating the part, coating conditions such  
as material, curing temperature, and so on must be  
evaluated deeply.  
8. Accurate test circuit values are required to measure  
electrical characteristics.  
It may be a cause of mis-correlation if there is any  
deviation, especially stray capacitance, from the test  
circuit in the specification.  
44  
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