Notice
6. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
• Tip temperature : 340°C max.
• Soldering time : 3(+1,-0) s
• Tip diameter : φ2mm max.
• Times : 1time only.
• Soldering iron output : 30W max.
Note : Adjust the pre-heat temperature to ⊿T＜190℃ between the component and a soldering iron.
Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the material due to the thermal shock.
7. Solder Volume
Solder shall be used not to be exceeded as shown below.
Upper Limit
Upper Limit
Recommendable
Recommendable
t
1/3T
t T(T:Chip thickness)
1/3T≤t (T:Chip Thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
8. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol (IPA))
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power
: 20W / l max.
Frequency : 28kHz to 40kHz
Time
: 5 minutes max.
(3) Cleaner
1. Cleaner
ꢀꢀIsopropyl alcohol (IPA)
2. Aqueous agent
ꢀꢀPINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
9. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance, such as
insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
10. Resin coating
The capacitance value may change and/or it may affect on the product's performance due to high cure-stress of resin
to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use, please
make the reliability evaluation with the product mounted in your application set.
11. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
ꢀꢀꢀꢀꢀꢀBending ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ
ꢀꢀꢀꢀꢀTwisting
JEMCPC-02243B
8
MURATA [ muRata ]
