Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
1. Flux and Solder
Flux
Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%).
Do not use water-soluble flux.
Other flux (except above) Please contact us for details, then use.
Solder
Use Sn-3.0Ag-0.5Cu solder
Use of Sn-Zn based solder will deteriorate performance of products.
In case of using Sn-Zn based solder, please contact Murata in advance.
2. Note for Assembling
< Points of Attention about NFM Pattern Forms>
The loaded stresses are different to a chip depend on PCB materials and structures.
When the chip will be mounted on the metal PCB contained alumina material, PCB heat expansion/contraction
will be a cause of chip cracks because the coefficients of thermal expressions are different between metal PCB
and the chip itself. In case of mounting 1005 or smaller size of NFM on single-layered glass epoxy board,
chip cracks will be occurred because of the same reason.
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products surface is limited
to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is
limited to 100°C max.
3. Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
[Products direction]
a
b
Products shall be located in the sideways
direction (Length:a<b) to the mechanical stress.
Poor example
〈
〉
Good example
〈
〉
(2) Products location on P.C.B. near seam for separation.
C
B
Seam
Products (A,B,C,D) shall be located carefully so that products are
not subject to the mechanical stress due to warping the board.
Because they may be subjected the mechanical stress in order
of A>C>B≒D.
D
A
a
b
Slit
Length:a b
4. Pre-heating Temperature
Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be
limited to 100°C max. to avoid the heat stress for the products.
5. Reflow Soldering
ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ• Standard printing pattern of solder paste.
1) Soldering paste printing for reflow
• Standard thickness of solder paste: 100µm to 150µm.
• Use the solder paste printing pattern of the right pattern.
• For the resist and copper foil pattern, use standard land dimensions.
0.25
0.7
(in mm)
1.3
2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of
product quality.
260°C
Temp.
(°C)
245°C±3°C
230°C
220°C
Limit Profile
180
150
30s 60s
～
Standard Profile
60s max.
90s±30s
Standard Profile
Time.(s)
Limit Profile
Pre-heating
150°C ~ 180°C , 90s ± 30s
above 220°C , 30s ~ 60s
245°C ± 3°C
Heating
above 230°C , 60s max.
260°C , 10s
Peak temperature
Cycle of reflow
2 times
2 times
JEMCPC-02243B
7
MURATA [ muRata ]
