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!Note
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C02E.pdf
sales representatives or product engineers before ordering.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering0. 9.9.18
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Reference Data
Continued from the preceding page.
4. Board Bending Strength for Board Material
(1) Test Method
Solder the chip to the test board. Then bend the board
using the method illustrated below, to measure
capacitance.
50
Pressurizing
Speed : 1.0mm/sec.
20
Capacitor
Pressurize
Note : Material of the pressurizing jig and
R230
the supporting base must be hardened steel
(Hardness : HB183 to 255 or carbide Hardness
: HRA90 min.)
Supporting
Base
45
45
Flexure
Capacitance Meter
Solder Amount
1.2
Up to Chip
Thickness
4.0
1.6
100
: Copper Foil (0.035mm thick)
: Solder Resist
(in mm)
8
(2) Test Samples
GRM21 5C/R7/F5 Characteristics T=0.6mm typical
(3) Acceptance Criteria
Products should be determined to be defective if the
change in capacitance has exceeded the values specified
in Table 4.
Table 4
Characteristics
Change in Capacitance
Within T5% or T0.5pF, whichever is greater
Within T12.5%
5C
R7
F5
Within T20%
(4) Results
GRM21 R7 (T=0.6)
GRM21 5C (T=0.6)
100
80
60
40
20
0
100
Paper Phenol
Paper Phenol
80
60
Glass Epoxy
40
20
0
Glass Epoxy
0
2
4
6
8
0
2
4
6
8
Flexure (mm)
Flexure (mm)
GRM21 F5 (T=0.6)
100
80
60
40
20
0
Paper Phenol
Glass Epoxy
0
2
4
6
8
Flexure (mm)
Continued on the following page.
162
MURATA [ muRata ]
