欢迎访问ic37.com |
会员登录 免费注册
发布采购

SPAKDSP303VF100 参数 Datasheet PDF下载

SPAKDSP303VF100图片预览
型号: SPAKDSP303VF100
PDF下载: 下载PDF文件 查看货源
内容描述: [Digital Signal Processor, 24-Ext Bit, 100MHz, CMOS, PBGA196, 15 X 15 MM, 1 MM PITCH, MOLD ARRAY PROCESS, BGA-196]
分类和应用: 时钟外围集成电路
文件页数/大小: 112 页 / 1117 K
品牌: MOTOROLA [ MOTOROLA ]
 浏览型号SPAKDSP303VF100的Datasheet PDF文件第88页浏览型号SPAKDSP303VF100的Datasheet PDF文件第89页浏览型号SPAKDSP303VF100的Datasheet PDF文件第90页浏览型号SPAKDSP303VF100的Datasheet PDF文件第91页浏览型号SPAKDSP303VF100的Datasheet PDF文件第93页浏览型号SPAKDSP303VF100的Datasheet PDF文件第94页浏览型号SPAKDSP303VF100的Datasheet PDF文件第95页浏览型号SPAKDSP303VF100的Datasheet PDF文件第96页  
Electrical Design Considerations  
A complicating factor is the existence of three common ways to determine the junction-to-case thermal  
resistance in plastic packages.  
• To minimize temperature variation across the surface, the thermal resistance is measured from the  
junction to the outside surface of the package (case) closest to the chip mounting area when that surface  
has a proper heat sink.  
• To define a value approximately equal to a junction-to-board thermal resistance, the thermal resistance  
is measured from the junction to the point at which the leads attach to the case.  
• If the temperature of the package case (T ) is determined by a thermocouple, thermal resistance is  
T
computed from the value obtained by the equation (T – T )/P .  
J
T
D
As noted earlier, the junction-to-case thermal resistances quoted in this data sheet are determined using  
the first definition. From a practical standpoint, that value is also suitable to determine the junction  
temperature from a case thermocouple reading in forced convection environments. In natural convection,  
the use of the junction-to-case thermal resistance to estimate junction temperature from a thermocouple  
reading on the case of the package will yield an estimate of a junction temperature slightly higher than  
actual temperature. Hence, the new thermal metric, thermal characterization parameter or Ψ , has been  
JT  
defined to be (T – T )/P . This value gives a better estimate of the junction temperature in natural  
J
T
D
convection when the surface temperature of the package is used. Remember that surface temperature  
readings of packages are subject to significant errors caused by inadequate attachment of the sensor to the  
surface and to errors caused by heat loss to the sensor. The recommended technique is to attach a  
40-gauge thermocouple wire and bead to the top center of the package with thermally conductive epoxy.  
4.2 Electrical Design Considerations  
CAUTION  
This device contains protective circuitry to  
guard against damage due to high static  
voltage or electrical fields. However, normal  
precautions are advised to avoid application  
of any voltages higher than maximum rated  
voltages to this high-impedance circuit.  
Reliability of operation is enhanced if unused  
inputs are tied to an appropriate logic voltage  
level (for example, either GND or VCC).  
4-2  
 
 复制成功!