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SPAKDSP303VF100 参数 Datasheet PDF下载

SPAKDSP303VF100图片预览
型号: SPAKDSP303VF100
PDF下载: 下载PDF文件 查看货源
内容描述: [Digital Signal Processor, 24-Ext Bit, 100MHz, CMOS, PBGA196, 15 X 15 MM, 1 MM PITCH, MOLD ARRAY PROCESS, BGA-196]
分类和应用: 时钟外围集成电路
文件页数/大小: 112 页 / 1117 K
品牌: MOTOROLA [ MOTOROLA ]
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Chapter 4  
Design  
Considerations  
4.1 Thermal Design Considerations  
An estimate of the chip junction temperature, T , in °C can be obtained from  
J
this equation:  
Equation 1: TJ = TA + (PD × RθJA  
)
Where:  
T
=
=
=
ambient temperature °C  
A
R
package junction-to-ambient thermal resistance °C/W  
power dissipation in package  
θJA  
P
D
Historically, thermal resistance has been expressed as the sum of a  
junction-to-case thermal resistance and a case-to-ambient thermal resistance,  
as in this equation:  
Equation 2: RθJA = RθJC + RθCA  
Where:  
R
R
R
=
=
=
package junction-to-ambient thermal resistance °C/W  
package junction-to-case thermal resistance °C/W  
package case-to-ambient thermal resistance °C/W  
θJA  
θJC  
θCA  
R
is device-related and cannot be influenced by the user. The user controls  
θJC  
the thermal environment to change the case-to-ambient thermal resistance,  
. For example, the user can change the air flow around the device, add a  
R
θCA  
heat sink, change the mounting arrangement on the printed circuit board  
(PCB) or otherwise change the thermal dissipation capability of the area  
surrounding the device on a PCB. This model is most useful for ceramic  
packages with heat sinks; some 90 percent of the heat flow is dissipated  
through the case to the heat sink and out to the ambient environment. For  
ceramic packages, in situations where the heat flow is split between a path to  
the case and an alternate path through the PCB, analysis of the device thermal  
performance may need the additional modeling capability of a system-level  
thermal simulation tool.  
The thermal performance of plastic packages is more dependent on the  
temperature of the PCB to which the package is mounted. Again, if the  
estimates obtained from R  
do not satisfactorily answer whether the thermal  
θJA  
performance is adequate, a system-level model may be appropriate.  
4-1  
 
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