< IGBT MODULES >
CM100TX-24S
HIGH POWER SWITCHING USE
INSULATED TYPE
ELECTRICAL CHARACTERISTICS (cont; T
j
=25 °C, unless otherwise specified)
NTC THERMISTOR PART
Symbol
R
25
∆R/R
B
(25/50)
P
25
Item
Zero-power resistance
Deviation of resistance
B-constant
Power dissipation
T
C
=25 °C
(Note4)
(Note4)
(Note7)
Conditions
Limits
Min.
4.85
-7.3
-
-
Typ.
5.00
-
3375
-
Max.
5.15
+7.8
-
10
Unit
kΩ
%
K
mW
R
100
=493
Ω,
T
C
=100 °C
Approximate by equation
T
C
=25 °C
(Note4)
THERMAL RESISTANCE CHARACTERISTICS
Symbol
R
th(j-c)Q
R
th(j-c)D
R
th(c-s)
Item
Thermal resistance
(Note4)
Conditions
Junction to case, per Inverter IGBT
Junction to case, per Inverter FWDi
(Note4)
Limits
Min.
-
-
-
Typ.
-
-
15
Max.
0.20
0.29
-
Unit
K/W
K/kW
Contact thermal resistance
Case to heat sink, per 1 module,
Thermal grease applied
(Note7)
MECHANICAL CHARACTERISTICS
Symbol
M
s
d
s
d
a
m
e
c
Mounting torque
Creepage distance
Clearance
Weight
Flatness of base plate
Item
Conditions
Mounting to heat sink
Terminal to terminal
Terminal to base plate
Terminal to terminal
Terminal to base plate
-
On the centerline X, Y
(Note8)
Limits
Min.
M 5 screw
2.5
10.28
14.27
10.28
12.33
-
±0
Typ.
3.0
-
-
-
-
300
-
Max.
3.5
-
-
-
-
-
+100
Unit
N·m
mm
mm
g
μm
Note1. Represent ratings and characteristics of the anti-parallel, emitter-collector free wheeling diode (FWDi).
2. Junction temperature (T
j
) should not increase beyond T
j m a x
rating.
3. Pulse width and repetition rate should be such that the device junction temperature (T
j
) dose not exceed T
j m a x
rating.
4. Case temperature (T
C
) and heat sink temperature (T
s
) are defined on the each surface (mounting side) of base plate and heat sink
just under the chips. Refer to the figure of chip location.
5. Pulse width and repetition rate should be such as to cause negligible temperature rise.
Refer to the figure of test circuit.
R
1
1
6.
B
(
25
/
50
)
½
ln(
25
) /(
)
,
R
50
T
25
T
50
R
25
: resistance at absolute temperature T
25
[K]; T
25
=25 [°C]+273.15=298.15 [K]
R
50
: resistance at absolute temperature T
50
[K]; T
50
=50 [°C]+273.15=323.15 [K]
7. Typical value is measured by using thermally conductive grease of
λ=0.9
W/(m·K).
8. The base plate (mounting side) flatness measurement points (X, Y) are as follows of the following figure.
-:Concave
+:Convex
Y
X
mounting side
mounting side
-:Concave
mounting side
+:Convex
9. Use the following screws when mounting the printed circuit board (PCB) on the stand offs.
"ST2.6×10 or ST2.6×12 self tapping screw"
The length of the screw depends on the thickness of the PCB.
Publication Date : September 2012
3
MITSUBISHI [ MITSUBISHI ELECTRIC SEMICONDUCTOR ]
