ProASIC3 Flash Family FPGAs
1
I/Os Per Package
ProASIC3
Devices
A3P0152 A3P030 A3P060 A3P125
A3P250 3
A3P400 3
A3P600
A3P1000
Cortex-M1
Devices
M1A3P250 3,5
I/O Type
M1A3P400 3
M1A3P600
M1A3P1000
Package
QN48
–
49
–
34
49
81
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
QN68
–
–
–
–
QN1327
CS121
VQ100
TQ144
PQ208
FG144
FG2565,6
FG4846
Notes:
80
96
71
91
–
84
–
87
–
19
–
–
–
–
–
–
–
–
–
–
–
77
–
71
100
133
97
–
68
–
13
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
151
97
157
–
34
24
38
–
151
97
178
194
34
25
38
38
154
97
35
25
43
60
154
97
177
300
35
25
44
74
–
–
96
–
–
–
177
235
–
–
–
–
1. When considering migrating your design to a lower- or higher-density device, refer to the ProASIC3 FPGA Fabric User Guide to
ensure complying with design and board migration requirements.
2. A3P015 is not recommended for new designs.
3. For A3P250 and A3P400 devices, the maximum number of LVPECL pairs in east and west banks cannot exceed 15. Refer to
the ProASIC3 FPGA Fabric Users Guide for position assignments of the 15 LVPECL pairs.
4. Each used differential I/O pair reduces the number of single-ended I/Os available by two.
5. The M1A3P250 device does not support FG256 package.
6. FG256 and FG484 are footprint-compatible packages.
7. Package not available.
Table 1 • ProASIC3 FPGAs Package Sizes Dimensions
Package
CS121
QN48
QN68
QN132 * VQ100
TQ144
PQ208
FG144
FG256
FG484
Length × Width
(mm × mm)
6 × 6
6 × 6
8 × 8
8 × 8
14 × 14
20 × 20
28 × 28
13 × 13
17 × 17
23 × 23
Nominal Area
(mm2)
36
36
64
64
196
400
784
169
289
529
Pitch (mm)
0.5
0.4
0.4
0.5
0.5
0.5
0.5
1.0
1.0
1.0
Height (mm)
0.99
0.90
0.90
0.75
1.00
1.40
3.40
1.45
1.60
2.23
Note: * Package not available
Revision 18
III
MICROSEMI [ Microsemi ]
