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N25Q128A11B1241F 参数 Datasheet PDF下载

N25Q128A11B1241F图片预览
型号: N25Q128A11B1241F
PDF下载: 下载PDF文件 查看货源
内容描述: 128兆位, 1.8 V ,多个I / O , 4 KB的界别分组擦除引导扇区, XIP启用,串行闪存与108 MHz的SPI总线接口 [128-Mbit, 1.8 V, multiple I/O, 4-Kbyte subsector erase on boot sectors, XiP enabled, serial flash memory with 108 MHz SPI bus interface]
分类和应用: 闪存
文件页数/大小: 185 页 / 5874 K
品牌: MICRON [ MICRON TECHNOLOGY ]
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N25Q128 - 1.8 V  
Instructions  
The Write Volatile Enhanced Configuration register (WRVECR) instruction is entered by  
driving Chip Select (S) Low, followed by the instruction code and the data byte on serial data  
input (DQ0).  
Chip Select (S) must be driven High after the eighth bit of the data byte has been latched in.  
If not, the Write Volatile Enhanced Configuration register (WRVECR) instruction is not  
executed.  
When the new data are latched, the write enable latch (WEL) is reset.  
The Write Volatile Enhanced Configuration register (WRVECR) instruction allows the user to  
change the values of all the Volatile Enhanced Configuration Register bits, described in  
Table 7.: Volatile Enhanced Configuration Register.  
The Write Volatile Enhanced Configuration Register impacts the memory behavior right after  
the instruction is received by the device.  
Figure 41. Write Volatile Enhanced Configuration Register instruction sequence  
S
0
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15  
C
Instruction  
VECR In  
7
6
5
4
3
2
0
1
DQ0  
DQ1  
High Impedance  
MSB  
Write_VECR  
9.1.34  
Deep Power-down (DP)  
Executing the Deep Power-down (DP) instruction is the only way to put the device in the  
lowest consumption mode (the Deep Power-down mode). It can also be used as a software  
protection mechanism, while the device is not in active use, as in this mode, the device  
ignores all Write, Program and Erase instructions.  
Driving Chip Select (S) High deselects the device, and puts the device in the Standby Power  
mode (if there is no internal cycle currently in progress). But this mode is not the Deep  
Power-down mode. The Deep Power-down mode can only be entered by executing the  
Deep Power-down (DP) instruction, subsequently reducing the standby current (from I  
to  
CC1  
I
, as specified in Table 32).  
CC2  
To take the device out of Deep Power-down mode, the Release from Deep Power-down  
(RDP) instruction must be issued. No other instruction must be issued while the device is in  
Deep Power-down mode.  
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