欢迎访问ic37.com |
会员登录 免费注册
发布采购

MT48LC4M16A2P-75G 参数 Datasheet PDF下载

MT48LC4M16A2P-75G图片预览
型号: MT48LC4M16A2P-75G
PDF下载: 下载PDF文件 查看货源
内容描述: SDR SDRAM MT48LC16M4A2 â ????梅格4 ×4× 4银行MT48LC8M8A2 â ???? 2梅格×8× 4银行MT48LC4M16A2 â ???? 1梅格×16× 4银行 [SDR SDRAM MT48LC16M4A2 – 4 Meg x 4 x 4 Banks MT48LC8M8A2 – 2 Meg x 8 x 4 Banks MT48LC4M16A2 – 1 Meg x 16 x 4 Banks]
分类和应用: 动态存储器
文件页数/大小: 83 页 / 3595 K
品牌: MICRON [ MICRON TECHNOLOGY ]
 浏览型号MT48LC4M16A2P-75G的Datasheet PDF文件第12页浏览型号MT48LC4M16A2P-75G的Datasheet PDF文件第13页浏览型号MT48LC4M16A2P-75G的Datasheet PDF文件第14页浏览型号MT48LC4M16A2P-75G的Datasheet PDF文件第15页浏览型号MT48LC4M16A2P-75G的Datasheet PDF文件第17页浏览型号MT48LC4M16A2P-75G的Datasheet PDF文件第18页浏览型号MT48LC4M16A2P-75G的Datasheet PDF文件第19页浏览型号MT48LC4M16A2P-75G的Datasheet PDF文件第20页  
64Mb: x4, x8, x16 SDRAM  
Temperature and Thermal Impedance  
Temperature and Thermal Impedance  
It is imperative that the SDRAM device’s temperature specifications, shown in Temper-  
ature Limits below, be maintained to ensure the junction temperature is in the proper  
operating range to meet data sheet specifications. An important step in maintaining the  
proper junction temperature is using the device’s thermal impedances correctly. The  
thermal impedances are listed in Table 6 (page 17) for the applicable die revision and  
packages being made available. These thermal impedance values vary according to the  
density, package, and particular design used for each device.  
Incorrectly using thermal impedances can produce significant errors. Read Micron  
technical note TN-00-08, “Thermal Applications” prior to using the thermal impedan-  
ces listed in Table 6 (page 17). To ensure the compatibility of current and future de-  
signs, contact Micron Applications Engineering to confirm thermal impedance values.  
The SDRAM device’s safe junction temperature range can be maintained when the TC  
specification is not exceeded. In applications where the device’s ambient temperature  
is too high, use of forced air and/or heat sinks may be required to satisfy the case tem-  
perature specifications.  
Table 5: Temperature Limits  
Parameter  
Symbol  
Min  
0
Max  
80  
Unit  
Notes  
Operating case temperature  
Commercial  
Industrial  
TC  
°C  
1, 2, 3, 4  
–40  
–40  
0
90  
Automotive  
Commercial  
Industrial  
105  
85  
Junction temperature  
Ambient temperature  
TJ  
°C  
°C  
°C  
3
–40  
–40  
0
95  
Automotive  
Commercial  
Industrial  
110  
70  
TA  
3, 5  
–40  
–40  
85  
Automotive  
105  
260  
Peak reflow temperature  
Notes:  
TPEAK  
1. MAX operating case temperature, TC, is measured in the center of the package on the  
top side of the device, as shown in Figure 8 (page 17), and Figure 9 (page 18).  
2. Device functionality is not guaranteed if the device exceeds maximum TC during opera-  
tion.  
3. All temperature specifications must be satisfied.  
4. The case temperature should be measured by gluing a thermocouple to the top-center  
of the component. This should be done with a 1mm bead of conductive epoxy, as de-  
fined by the JEDEC EIA/JESD51 standards. Take care to ensure that the thermocouple  
bead is touching the case.  
5. Operating ambient temperature surrounding the package.  
PDF: 09005aef80725c0b  
64mb_x4x8x16_sdram.pdf - Rev. U 05/13 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
16  
© 1999 Micron Technology, Inc. All rights reserved.